SNVS441I January   2007  – November 2016 LP5521

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Charge Pump Electrical Characteristics
    7. 6.7  LED Driver Electrical Characteristics (R, G, B Outputs)
    8. 6.8  Logic Interface Characteristics
    9. 6.9  I2C Timing Requirements (SDA, SCL)
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Charge Pump Operational Description
        1. 7.3.1.1 Output Resistance
        2. 7.3.1.2 Controlling Charge Pump
        3. 7.3.1.3 LED Forward Voltage Monitoring
      2. 7.3.2 LED Driver Operational Description
      3. 7.3.3 Automatic Power Save
      4. 7.3.4 External Clock Detection
      5. 7.3.5 Logic Interface Operational Description
        1. 7.3.5.1 I/O Levels
        2. 7.3.5.2 GPO/INT Pins
        3. 7.3.5.3 TRIG Pin
        4. 7.3.5.4 ADDR_SEL0,1 Pins
        5. 7.3.5.5 CLK_32K Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Serial Bus Interface
        1. 7.5.1.1 Interface Bus Overview
        2. 7.5.1.2 Data Transactions
        3. 7.5.1.3 Acknowledge Cycle
        4. 7.5.1.4 Acknowledge After Every Byte Rule
        5. 7.5.1.5 Addressing Transfer Formats
        6. 7.5.1.6 Control Register Write Cycle
        7. 7.5.1.7 Control Register Read Cycle
      2. 7.5.2 LED Controller Operation Modes
        1. 7.5.2.1 Disabled
        2. 7.5.2.2 LOAD Program
        3. 7.5.2.3 RUN Program
          1. 7.5.2.3.1 DIRECT Control
      3. 7.5.3 LED Controller Programming Commands
        1. 7.5.3.1 RAMP/WAIT
        2. 7.5.3.2 Set PWM
        3. 7.5.3.3 Go to Start
        4. 7.5.3.4 Branch
        5. 7.5.3.5 End
        6. 7.5.3.6 Trigger
    6. 7.6 Register Maps
      1. 7.6.1  Enable Register (Enable)
      2. 7.6.2  Operation Mode Register (OP Mode)
      3. 7.6.3  R Channel PWM Control (R_PWM)
      4. 7.6.4  G Channel PWM Control (G_PWM)
      5. 7.6.5  B Channel PWM Control (B_PWM)
      6. 7.6.6  R Channel Current (R_CURRENT)
      7. 7.6.7  G Channel Current (G_CURRENT)
      8. 7.6.8  B Channel Current (B_CURRENT)
      9. 7.6.9  Configuration Control (CONFIG)
      10. 7.6.10 R Channel Program Counter Value (R Channel PC)
      11. 7.6.11 G Channel Program Counter Value (G Channel PC)
      12. 7.6.12 B Channel Program Counter Value (B Channel PC)
      13. 7.6.13 Status/Interrupt Register
      14. 7.6.14 RESET Register
      15. 7.6.15 GPO Register
      16. 7.6.16 Program Memory
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Application with Charge Pump
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Application Without Charge Pump
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedures
    3. 8.3 Initialization Setup
      1. 8.3.1 Program Load and Execution Example
      2. 8.3.2 Direct PWM Control Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.