SNVS500C July   2007  – November 2016 LP5524

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 LED Driver Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LED
      2. 7.3.2 LED Headroom Voltage
      3. 7.3.3 LED Outputs
      4. 7.3.4 PWM Brightness Control
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Mode
      2. 7.4.2 ISET Pin
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Recommended External Components
          1. 8.2.2.1.1 Input Capacitor, CIN
          2. 8.2.2.1.2 Current Set Resistor, RISET
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (June 2016) to C Revision

  • Changed wording of data sheet title Go

Changes from A Revision (May 2013) to B Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted lead temperature and soldering rows from Abs Max table - information in POA Go
  • Added Thermal Information table with revised RθJA value (from "80 - 125°C/W" to "101.9°C/W") and added additional thermal values. Go

Changes from * Revision (April 2013) to A Revision

  • Changed layout of National Data Sheet to TI formatGo