SNVS820B APRIL   2013  – December 2016 LP5562

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Logic Interface Characteristics
    7. 6.7  Recommended External Clock Source Conditions
    8. 6.8  I2C Timing Requirements (SDA, SCL)
    9. 6.9  Typical Characteristics: Current Consumption
    10. 6.10 Typical Characteristics: LED Output
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  LED Drivers Operational Description
        1. 7.3.1.1 LED Driver Current Control
        2. 7.3.1.2 Controlling LED Driver Output PWM
      2. 7.3.2  Direct I2C Register PWM Control Example
      3. 7.3.3  Program Execution Engines
        1. 7.3.3.1 Program Execution Engine States
        2. 7.3.3.2 Program Execution Engine Operation Modes
          1. 7.3.3.2.1 Operation Modes
        3. 7.3.3.3 Program Execution Engine Program Counter (PC)
        4. 7.3.3.4 Program Execution Engine Programming Commands
          1. 7.3.3.4.1 Ramp/Wait
          2. 7.3.3.4.2 Set PWM
          3. 7.3.3.4.3 Go-to-Start
          4. 7.3.3.4.4 Branch
          5. 7.3.3.4.5 End
          6. 7.3.3.4.6 Trigger
        5. 7.3.3.5 Program Load and Execution Example
      4. 7.3.4  Power-Save Mode
      5. 7.3.5  External Clock
      6. 7.3.6  Thermal Shutdown
      7. 7.3.7  Logic Interface Operational Description
      8. 7.3.8  I/O Levels
      9. 7.3.9  ADDR_SEL0, ADDR_SEL1 Pins
      10. 7.3.10 CLK_32 Pin
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 SRAM Memory
      2. 7.5.2 I2C-Compatible Serial Bus Interface
        1. 7.5.2.1 Interface Bus Overview
        2. 7.5.2.2 Data Transactions
        3. 7.5.2.3 Acknowledge Cycle
        4. 7.5.2.4 Acknowledge After Every Byte Rule
        5. 7.5.2.5 Addressing Transfer Formats
        6. 7.5.2.6 Control Register Write Cycle
        7. 7.5.2.7 Control Register Read Cycle
        8. 7.5.2.8 Register Read/Write Format
    6. 7.6 Register Maps
      1. 7.6.1  Enable Register (Enable) (Address = 00h) [reset = 00h]
      2. 7.6.2  Operation Mode Register (OP Mode) (address = 01h) [reset = 00h]
      3. 7.6.3  B LED Output PWM Control Register (B_PWM) (address = 02h) [reset = 00h]
      4. 7.6.4  G LED Output PWM Control Register (G_PWM) (address = 03h) [reset = 00h]
      5. 7.6.5  R LED Output PWM Control Register (R_PWM) (address = 04h) [reset = 00h]
      6. 7.6.6  B LED Output Current Control Register (B_CURRENT)(address = 05h) [reset = AFh]
      7. 7.6.7  G LED Output Current Control Register (G_CURRENT)(address = 06h) [reset = AFh]
      8. 7.6.8  R LED Output Current Control Register (R_CURRENT) (address = 07h) [reset = AFh]
      9. 7.6.9  Configuration Control Register (CONFIG) (address = 08h) [reset = 00h]
      10. 7.6.10 Engine 1 Program Counter Value Register (Engine 1 PC) (address = 09h) [reset = 00h]
      11. 7.6.11 Engine 2 Program Counter Value Register (Engine 2 PC) (address = 0Ah) [reset = 00h]
      12. 7.6.12 Engine 3 Program Counter Value Register (Engine 3 PC) (address = 0Ah) [reset = 00h]
      13. 7.6.13 STATUS/INTERRUPT Register (address = 0Ch) [reset = 00h]
      14. 7.6.14 RESET Register (address = 0Dh) [reset = 00h]
      15. 7.6.15 WLED Output PWM Control Register (W_PWM) (address = 0Eh) [reset = 00h]
      16. 7.6.16 W LED Output Current Control Register (W_CURRENT) (address = 0Fh) [reset = AFh]
      17. 7.6.17 LED Mapping Register (LED Map) (address = 70h) [reset = 39h]
      18. 7.6.18 Program Memory (address = 10h - 6Fh) [reset = 00h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Current Configuration
        2. 8.2.2.2 PWM Frequency Configuration
        3. 8.2.2.3 Clock Source Configuration
        4. 8.2.2.4 Power-Save Mode Configuration
        5. 8.2.2.5 Light Engine Configuration
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
V (VDD, VEN/VCC, R, G, B, W) −0.3 6 V
Voltage on pins −0.3 VDD + 0.3 with 6 V maximum V
Continuous power dissipation(2) Internally limited
Junction temperature, TJ-MAX 125 °C
Maximum lead temperature (soldering) See(3)
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and disengages at TJ = 130°C (typical).
(3) For detailed soldering specifications and information, refer to Texas Instruments Application Note AN-1112 : DSBGA Wafer Level Chip Scale Package.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD 2.7 5.5 V
VEN/VCC 1.65 VDD V
Junction temperature, TJ −40 125 °C
Ambient temperature, TA(1) −40 85 °C
(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature
(TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.4 Thermal Information

THERMAL METRIC(1) LP5562 UNIT
YQE (DSBGA)
12 PINS
RθJA Junction-to-ambient thermal resistance 85.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.0 °C/W
RθJB Junction-to-board thermal resistance 15.3 °C/W
ψJT Junction-to-top characterization parameter 0.6 °C/W
ψJB Junction-to-board characterization parameter 15.4 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

6.5 Electrical Characteristics

Unless otherwise specified: limits for typical values are for TA = 25°C and minimum and maximum limits apply over the operating ambient temperature range (−40°C < TA < +85°C); VIN = 3.6V, VEN/VCC = 1.8 V.(1)(2)(3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CURRENT CONSUMPTION AND OSCILLATOR ELECTRICAL CHARACTERISTICS
IVDD Standby supply current EN = 0 (pin), CHIP_EN = 0 (bit), external 32 kHz clock running or not running 0.2 2 µA
EN = 1 (pin), CHIP_EN = 0 (bit),
external 32 kHz clock not running		 2 µA
EN = 1 (pin), CHIP_EN = 0 (bit)
External 32-kHz clock running		 2.4 µA
Normal mode supply current LED drivers disabled 0.25 mA
LED drivers enabled 1 mA
Powersave mode supply current External 32-kHz clock running 10 µA
Internal oscillator running 0.25 mA
ƒOSC Internal oscillator frequency accuracy TA = 25°C –4% 4%
–7% 7%
LED DRIVER ELECTRICAL CHARACTERISTICS (R, G, B, W OUTPUTS)
ILEAKAGE R, G, B, W pin leakage current TA = 25°C 0.1 1 µA
IMAX Maximum source current Outputs R, G, B, W 25.5 mA
IOUT Accuracy of output current(4) Output current set to 17.5 mA, VDD = 3.6 V
TA = 25°C		 –4% 4%
Output current set to 17.5 mA, VDD = 3.6 V –5% 5%
IMATCH Matching(4) Output current set to 17.5 mA, VDD = 3.6V 1% 2%
ƒLED LED PWM switching frequency PWM_HF = 1 558 Hz
PWM_HF = 0 256
VSAT Saturation voltage(5) Output current set to 17.5 mA
TA = 25°C		 60 100 mV
(1) The electrical characteristics tables list ensured specifications under the listed recommended conditions except as otherwise modified or specified by the electrical characteristics test conditions and/or notes. Typical specifications are estimations only and are not verified by production testing.
(2) All voltages are with respect to the potential at the GND pins.
(3) Minimum and maximum limits are ensured by design, test, or statistical analysis. Typical numbers are not verified by production, but do represent the most likely norm.
(4) Output current accuracy is the difference between the actual value of the output current and programmed value of this current. Matching is the maximum difference from the average. For the constant current outputs on the part, the following are determined: the maximum output current (MAX), the minimum output current (MIN), and the average output current of all outputs (AVG). Two matching numbers are calculated: (MAX – AVG)/AVG and (AVG – MIN)/AVG. The largest number of the two (worst case) is considered the matching figure. Note that some manufacturers have different definitions in use.
(5) Saturation voltage is defined as the voltage when the LED current has dropped 10% from the set value.

6.6 Logic Interface Characteristics

Unless otherwise specified: limits for typical values are for TA = 25°C and minimum and maximum limits apply over the operating ambient temperature range (−40°C < TA < +85°C); VEN = 1.65 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LOGIC INPUT EN
VIL Input low level 0.5 V
VIH Input high level 1.2 V
II Logic input current –1 1 µA
tDELAY Input delay(1) 2 µs
LOGIC INPUT SCL, SDA, CLK_32K, ADDR_SEL0, ADDR_SEL1, VEN = 1.8 V
VIL Input low level 0.2 × VEN V
VIH Input high level 0.8 × VEN V
II Input current –1 1 µA
ƒCLK_32K Clock frequency 32 kHz
ƒSCL Clock frequency 400 kHz
LOGIC OUTPUT SDA
VOL Output low level IOUT = 3 mA (pullup current) 0.3 0.5 V
IL Output leakage current 1 µA
(1) The I2C host should allow at least 1ms before sending data to the LP5562 after the rising edge of the enable line.

6.7 Recommended External Clock Source Conditions

over operating free-air temperature range (unless otherwise noted)(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LOGIC INPUT CLK_32K
ƒCLK_32K Clock frequency 32.7 kHz
tCLKH High time 6 µs
tCLKL Low time 6 µs
tr Clock rise time 10% to 90% 2 µs
tf Clock fall time 90% to 10% 2 µs
(1) Specification is ensured by design and is not tested in production. VEN = 1.65 V to VDD.
(2) The ideal external clock signal for the LP5562 is a 0 V to VEN 25% to 75% duty-cycle square wave. At frequencies above 32.7 kHz, program execution will be faster and at frequencies below 32.7 kHz program execution will be slower.

6.8 I2C Timing Requirements (SDA, SCL)

See(1)
MIN MAX UNIT
ƒSCL Clock frequency 400 kHz
1 Hold time (repeated) START condition 0.6 µs
2 Clock low time 1.3 µs
3 Clock high time 600 ns
4 Setup time for a repeated START condition 600 ns
5 Data hold time 50 ns
6 Data setup time 100 ns
7 Rise time of SDA and SCL 20 + 0.1Cb 300 ns
8 Fall time of SDA and SCL 15 + 0.1Cb 300 ns
9 Set-up time for STOP condition 600 ns
10 Bus-free time between a STOP and a START condition 1.3 µs
Cb Capacitive load for each bus line 10 200 pF
(1) Specification is ensured by design and is not tested in production. VEN = 1.65 V to VDD.
LP5562 30197417.gif Figure 1. External Clock Timing
LP5562 30197402.gif Figure 2. I2C Timing Parameters

6.9 Typical Characteristics: Current Consumption

Unless otherwise specified: VDD = 3.6 V, VEN = 3.3 V. Here are presented input current consumption measurements. Current consumption is measured during a LED blink program execution. Program code sets every LED output to full PWM value for 2 seconds and then PWM is set to 0 for 2 seconds. This is looped endlessly. 750 measurements are taken during one measurement cycle.
LP5562 30197419.png Figure 3. Input Current Consumption in Normal Mode With External Clock Running. 4 LEDs (RGBW) Set as Load. Every LED Driver Current Value Is Set to 10 mA.
LP5562 30197420.png Figure 5. Input Current Consumption in Power Save Mode With External Clock Running, no LEDs as Load. All 4 LED Drivers are Enabled During Program Execution.
LP5562 30197424.png Figure 7. Input Current Consumption in Power Save Mode With External Clock Running, no LEDs as Load. Only 1 LED Driver is Enabled During Program Execution.
LP5562 30197425.png Figure 9. Input Current Consumption in Power Save Mode With External Clock Running, no LEDs as Load and no LED Drivers are Enabled During Program Execution.
LP5562 30197423.png Figure 4. Input Current Consumption in Normal Mode With Internal Clock Running. 4 LEDs (RGBW) set as Load. Every LED Driver Current Value is Set to 10 mA .
LP5562 30197421.png Figure 6. Input Current Consumption in Power Save Mode With Internal Clock Running, no LEDs as Load. All 4 LED Drivers are Enabled During Program Execution.
LP5562 30197422.png Figure 8. Input Current Consumption in Power Save Mode With Internal Clock Running, no LEDs as Load. Only 1 LED Driver is Enabled During Program Execution.

6.10 Typical Characteristics: LED Output

LED driver typical performance images.
LP5562 30197426.png Figure 10. Every LED Driver Saturation Voltage, Current Setting 17.5 mA
LP5562 30197428.png Figure 12. LED Driver Current Accuracy With Different Current Setting
LP5562 30197427.png Figure 11. LED Driver Currents Compared to Current Setting Code
LP5562 30197429.png Figure 13. LED Driver Current Matching Between all LED Drivers With Different Current Setting