SNVSCC9A November   2023  – August 2024 LP5812

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Time-Cross-Multiplexing (TCM) Scheme
        1. 6.3.1.1 Direct drive mode
        2. 6.3.1.2 TCM Drive Mode
        3. 6.3.1.3 Mix drive mode
        4. 6.3.1.4 Ghosting Elimination
      2. 6.3.2 Analog Dimming
      3. 6.3.3 PWM Dimming
      4. 6.3.4 Autonomous Animation Engine Control
        1. 6.3.4.1 Animation Engine Pattern
        2. 6.3.4.2 Sloper
        3. 6.3.4.3 Animation Engine Unit (AEU)
        4. 6.3.4.4 Animation Pause Unit (APU)
      5. 6.3.5 Protections and Diagnostics
        1. 6.3.5.1 LED Open Detections
        2. 6.3.5.2 LED Short Detections
        3. 6.3.5.3 Thermal Shutdown
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
    6. 6.6 Register Maps
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Parameters
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Input Capacitor Selection
        2. 7.2.3.2 Program Procedure
        3. 7.2.3.3 Programming Example
      4. 7.2.4 Application Performance Plots
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
  • DSD|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.