SNVSCC9B November   2023  – December 2024 LP5812

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Cross-Multiplexing (TCM) Scheme
        1. 7.3.1.1 Direct drive mode
        2. 7.3.1.2 TCM Drive Mode
        3. 7.3.1.3 Mix drive mode
        4. 7.3.1.4 Ghosting Elimination
      2. 7.3.2 Analog Dimming
      3. 7.3.3 PWM Dimming
      4. 7.3.4 Autonomous Animation Engine Control
        1. 7.3.4.1 Animation Engine Pattern
        2. 7.3.4.2 Sloper
        3. 7.3.4.3 Animation Engine Unit (AEU)
        4. 7.3.4.4 Animation Pause Unit (APU)
      5. 7.3.5 Protections and Diagnostics
        1. 7.3.5.1 LED Open Detections
        2. 7.3.5.2 LED Short Detections
        3. 7.3.5.3 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Parameters
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Input Capacitor Selection
        2. 8.2.3.2 Program Procedure
        3. 8.2.3.3 Programming Example
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
  • DSD|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1.3 Mix drive mode

The mix drive mode can drive LEDs separately by direct-drive and TCM-drive in the same time. The mix drive mode is configured by setting led_mode = 5h/6h/7h for 1/2/3 scans. After setting the scan count, scan_order_x (x = 1, 2, 3, 4) needs to be written for the scan orders. Then the direct drive LEDs need to be configured by mix_sel_led in Dev_Config_1 register. To control the LEDs, LED_x (x = 0, 1, 2, 3) in the register map is for the direct drive LEDs, while LED_xy (x = A, B, C, D; y = 0, 1, 2) is for the TCM drive LEDs.

The typical application diagrams are illustrated as Figure 7-8 (1 scan), Figure 7-9 (2 scans) and Figure 7-10 (3 scans).

LP5812 Mix drive, 1 scan (led_mode = 5h, scan_order_0 = 0h, mix_sel_led = 8h) Figure 7-8 Mix drive, 1 scan (led_mode = 5h, scan_order_0 = 0h, mix_sel_led = 8h)
LP5812 Mix drive mode, 2 scans (led_mode = 6h, scan_order_0 = 0h, scan_order_1 = 1h, mix_sel_led = 8h) Figure 7-9 Mix drive mode, 2 scans (led_mode = 6h, scan_order_0 = 0h, scan_order_1 = 1h, mix_sel_led = 8h)
LP5812 Mix drive mode, 3 scans (led_mode = 7h, scan_order_0 = 0h, scan_order_1 = 1h, scan_order_2 = 2h, mix_sel_led = 8h) Figure 7-10 Mix drive mode, 3 scans (led_mode = 7h, scan_order_0 = 0h, scan_order_1 = 1h, scan_order_2 = 2h, mix_sel_led = 8h)