SNVSCC9B November   2023  – December 2024 LP5812

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Cross-Multiplexing (TCM) Scheme
        1. 7.3.1.1 Direct drive mode
        2. 7.3.1.2 TCM Drive Mode
        3. 7.3.1.3 Mix drive mode
        4. 7.3.1.4 Ghosting Elimination
      2. 7.3.2 Analog Dimming
      3. 7.3.3 PWM Dimming
      4. 7.3.4 Autonomous Animation Engine Control
        1. 7.3.4.1 Animation Engine Pattern
        2. 7.3.4.2 Sloper
        3. 7.3.4.3 Animation Engine Unit (AEU)
        4. 7.3.4.4 Animation Pause Unit (APU)
      5. 7.3.5 Protections and Diagnostics
        1. 7.3.5.1 LED Open Detections
        2. 7.3.5.2 LED Short Detections
        3. 7.3.5.3 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Parameters
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Input Capacitor Selection
        2. 8.2.3.2 Program Procedure
        3. 8.2.3.3 Programming Example
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
  • DSD|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions


LP5812 LP5812 YBH Package 9-Pin DSBGA Top View

Figure 5-1 LP5812 YBH Package 9-Pin DSBGA Top View

LP5812 LP5812 DSD Package 8-Pin WSON Top View

Figure 5-2 LP5812 DSD Package 8-Pin WSON Top View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME YBH DSD
OUT0 A1 8 O Output 0 which contains current sink 0 and high-side scan FET 0. If not used, this pin must be floating.
GND A2

Thermal

Pad

 G Ground. Must be connected to the common ground plane
VCC A3 1 P Boost converter output. A 22 uF capacitor is recommended to be connected between this pin with GND and be placed as close to the device as possible.
OUT1 B1 7 O Output 1 which contains current sink 1 and high-side scan FET 1. If not used, this pin must be floating.
SYNC B2 2 I/O Synchronous between multiple devices. If not used, this pin can be connected to ground to save power.
SCL B3 3 I I2C serial interface clock input.
OUT2 C1 6 O Output 2 which contains current sink 2 and high-side scan FET 2. If not used, this pin must be floating.
OUT3 C2 5 O Output 3 which contains current sink 3 and high-side scan FET 3. If not used, this pin must be floating.
SDA C3 4 I/O I2C serial interface data input/output.
(1) P: Power Pin; I: Input Pin; I/O: Input/Output Pin; O: Output Pin.