SNVSCC9 November 2023 LP5812
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
PIN | TYPE(1) | DESCRIPTION | ||
---|---|---|---|---|
NAME | YBH | DSD | ||
OUT0 | A1 | 8 | O | Output 0 which contains current sink and scan FET. If not used, this pin must be floating. |
GND | A2 | Thermal pad | G | Ground. This pin must connect to the common ground plane. |
VCC | A3 | 1 | P | Power supply of the device. |
OUT1 | B1 | 7 | O | Output 1 which contains current sink and scan FET. If not used, this pin must be floating. |
SYNC | B2 | 2 | I/O | Clock synchronous among multiple devices. If not used, this pin can connect to ground to save power. |
SCL | B3 | 3 | I | I2C serial interface clock input. |
OUT2 | C1 | 6 | O | Output 2 which contains current sink and scan FET. If not used, this pin must be floating. |
OUT3 | C2 | 5 | O | Output 3 which contains current sink and scan FET. If not used, this pin must be floating. |
SDA | C3 | 4 | I/O | I2C serial interface data input/output. |