SNVSCC9B November   2023  – December 2024 LP5812

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Cross-Multiplexing (TCM) Scheme
        1. 7.3.1.1 Direct drive mode
        2. 7.3.1.2 TCM Drive Mode
        3. 7.3.1.3 Mix drive mode
        4. 7.3.1.4 Ghosting Elimination
      2. 7.3.2 Analog Dimming
      3. 7.3.3 PWM Dimming
      4. 7.3.4 Autonomous Animation Engine Control
        1. 7.3.4.1 Animation Engine Pattern
        2. 7.3.4.2 Sloper
        3. 7.3.4.3 Animation Engine Unit (AEU)
        4. 7.3.4.4 Animation Pause Unit (APU)
      5. 7.3.5 Protections and Diagnostics
        1. 7.3.5.1 LED Open Detections
        2. 7.3.5.2 LED Short Detections
        3. 7.3.5.3 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Parameters
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Input Capacitor Selection
        2. 8.2.3.2 Program Procedure
        3. 8.2.3.3 Programming Example
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
  • DSD|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

The input capacitor needs not only to be close to the VCC pin, but also to the GND pin in order to reduce input supply ripple. For OUTx (x = 0, 1, 2, 3), low inductive and resistive path of switch load loop can help to provide a high slew rate. Therefore, path of adjecent outputs must be short and wide and avoid parallel wiring and narrow trace. For better thermal performance, TI suggest to make copper polygon connected with each pin bigger.