SNVSCC9 November   2023 LP5812

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. 7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Time-cross-multiplexing (TCM) scheme
        1. 8.3.1.1 Direct drive mode
        2. 8.3.1.2 TCM drive mode
        3. 8.3.1.3 Mix drive mode
        4. 8.3.1.4 Ghosting elimination
      2. 8.3.2 Analog Dimming
      3. 8.3.3 PWM Dimming
      4. 8.3.4 Autonomous Animation Engine Control
        1. 8.3.4.1 Animation Engine Pattern
        2. 8.3.4.2 Sloper
        3. 8.3.4.3 Animation Engine Unit (AEU)
        4. 8.3.4.4 Animation Pause Unit (APU)
      5. 8.3.5 Protections and Diagnostics
        1. 8.3.5.1 LED Open Detections
        2. 8.3.5.2 LED Short Detections
        3. 8.3.5.3 Thermal Shutdown
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
    6. 8.6 Register Maps
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Parameters
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Input Capacitor Selection
        2. 9.2.3.2 Program Procedure
        3. 9.2.3.3 Programming Example
      4. 9.2.4 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
  • DSD|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LP5812/0 UNIT
YBH (DSBGA) DRR (WSON)
9 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 113.1 50.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.6 51.1 °C/W
RθJB Junction-to-board thermal resistance 33.9 22.9 °C/W
ΨJT Junction-to-top characterization parameter 0.2 1.1 °C/W
ΨJB Junction-to-board characterization parameter 33.8 22.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 8.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.