SNVSC74B September   2023  – December 2024 LP5813

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Synchronous Boost Converter
        1. 7.3.1.1 Undervoltage Lockout
        2. 7.3.1.2 Enable and Soft Start
        3. 7.3.1.3 Switching Frequency
        4. 7.3.1.4 Current Limit Operation
        5. 7.3.1.5 Boost PWM Mode
        6. 7.3.1.6 Boost PFM Mode
        7. 7.3.1.7 Pass-Through Mode
      2. 7.3.2 Time-Cross-Multiplexing (TCM) Scheme
        1. 7.3.2.1 Direct drive mode
        2. 7.3.2.2 TCM Drive Mode
        3. 7.3.2.3 Mix drive mode
        4. 7.3.2.4 Ghosting Elimination
      3. 7.3.3 Analog Dimming
      4. 7.3.4 PWM Dimming
      5. 7.3.5 Autonomous Animation Engine Control
        1. 7.3.5.1 Animation Engine Pattern
        2. 7.3.5.2 Sloper
        3. 7.3.5.3 Animation Engine Unit (AEU)
        4. 7.3.5.4 Animation Pause Unit (APU)
      6. 7.3.6 Protections and Diagnostics
        1. 7.3.6.1 Overvoltage Protection
        2. 7.3.6.2 Output Short-to-Ground Protection
        3. 7.3.6.3 LED Open Detections
        4. 7.3.6.4 LED Short Detections
        5. 7.3.6.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  9. 8 Register Map Table
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Parameters
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Inductor Selection
        2. 9.2.3.2 Output Capacitor Selection
        3. 9.2.3.3 Input Capacitor Selection
        4. 9.2.3.4 Program Procedure
        5. 9.2.3.5 Programming Example
      4. 9.2.4 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Comparison

PART NUMBER Max LED Number Power Stage PACKAGE MATERIAL I2C Chip Address SOFTWARE COMPATIBLE
Bit 4 Bit 3
LP5813 12 Boost DSBGA-12 LP5813AYBHR 0 0 Yes
LP5813BYBHR 0 1
LP5813CYBHR 1 0
LP5813DYBHR 1 1
WSON-12 LP5813ADRRR 0 0
LP5813BDRRR 0 1
LP5813CDRRR 1 0
LP5813DDRRR 1 1
LP5812 12 Linear DSBGA-9 LP5812AYBHR 0 0
LP5812BYBHR 0 1
LP5812CYBHR 1 0
LP5812DYBHR 1 1
WSON-8 LP5812ADSDR 0 0
LP5812BDSDR 0 1
LP5812CDSDR 1 0
LP5812DDSDR 1 1
LP5811 4 Boost DSBGA-12 LP5811AYBHR 0 0
LP5811BYBHR 0 1
LP5811CYBHR 1 0
LP5811DYBHR 1 1
WSON-12 LP5811ADRRR 0 0
LP5811BDRRR 0 1
LP5811CDRRR 1 0
LP5811DDRRR 1 1
LP5810 4 Linear DSBGA-9 LP5810AYBHR 0 0
LP5810BYBHR 0 1
LP5810CYBHR 1 0
LP5810DYBHR 1 1
WSON-8 LP5810ADSDR 0 0
LP5810BDSDR 0 1
LP5810CDSDR 1 0
LP5810DDSDR 1 1