SNVSC74A September 2023 – July 2024 LP5813
PRODUCTION DATA
THERMAL METRIC(1) | LP5810/2 | LP5811/3 | UNIT | |||
---|---|---|---|---|---|---|
YBH (DSBGA) | DSD (WSON) | YBH (DSBGA) | DRR (WSON) | |||
9 PINS | 8 PINS | 12 PINS | 12 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 113.1 | 50.8 | 92.1 | 47.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 0.6 | 51.1 | 0.4 | 45.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 33.9 | 22.9 | 25.9 | 20.9 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.2 | 1.1 | 0.2 | 0.7 | °C/W |
ΨJB | Junction-to-board characterization parameter | 33.8 | 22.8 | 25.8 | 20.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | 8.5 | n/a | 6.6 | °C/W |