SNVSCE3B May   2023  – November 2023 LP5866T

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Multiplexing Matrix
      2. 7.3.2 Analog Dimming (Current Gain Control)
        1. 7.3.2.1 Global 3-Bits Maximum Current (MC) Setting
        2. 7.3.2.2 3 Groups of 7-Bits Color Current (CC) Setting
        3. 7.3.2.3 Individual 8-bit Dot Current (DC) Setting
      3. 7.3.3 PWM Dimming
        1. 7.3.3.1 Individual 8-Bit / 16-Bit PWM for Each LED Dot
        2. 7.3.3.2 Programmable Groups of 8-Bit PWM Dimming
        3. 7.3.3.3 8-Bit PWM for Global Dimming
      4. 7.3.4 ON and OFF Control
      5. 7.3.5 Data Refresh Mode
      6. 7.3.6 Full Addressable SRAM
      7. 7.3.7 Protections and Diagnostics
        1. 7.3.7.1 LED Open Detection
        2. 7.3.7.2 LED Short Detection
        3. 7.3.7.3 Thermal Shutdown
        4. 7.3.7.4 UVLO (Under Voltage Lock Out)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Interface Selection
      2. 7.5.2 I2C Interface
        1. 7.5.2.1 I2C Data Transactions
        2. 7.5.2.2 I2C Data Format
        3. 7.5.2.3 Multiple Devices Connection
      3. 7.5.3 Programming
        1. 7.5.3.1 SPI Data Transactions
        2. 7.5.3.2 SPI Data Format
        3. 7.5.3.3 Multiple Devices Connection
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Program Procedure
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 VDD Input Supply Recommendations
      2. 8.3.2 VLED Input Supply Recommendations
      3. 8.3.3 VIO Input Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Typical Characteristics

Unless specified otherwise, typical characteristics apply over the full ambient temperature range (–55°C < TA < +125°C for LP5866TMRKPR, LP5864MRSMR, and LP5866MDBTR while –40°C < TA < +85°C for the other devices), VCC = 3.3V, VIO = 3.3V, VLED = 5V, ILED_Peak = 50mA, CVLED = 1μF, CVCC = 1μF.

LP5866T VCC UVLO Rising and Falling ThresholdsFigure 6-1 VCC UVLO Rising and Falling Thresholds
LP5866T VSAT vs Temperature Figure 6-3 VSAT vs Temperature
LP5866T VSAT vs Current Sinks (50mA) Figure 6-5 VSAT vs Current Sinks (50mA)
LP5866T VSAT vs Current Sinks (10mA)Figure 6-7 VSAT vs Current Sinks (10mA)
LP5866T High Side Switch RDSONFigure 6-9 High Side Switch RDSON
LP5866T VCC UVLO HysteresisFigure 6-2 VCC UVLO Hysteresis
LP5866T VSAT vs Current Sinks (100mA) Figure 6-4 VSAT vs Current Sinks (100mA)
LP5866T VSAT vs Current Sinks (30mA)Figure 6-6 VSAT vs Current Sinks (30mA)
LP5866T Current Sinks Voltage vs Current
TA = 25°C
Figure 6-8 Current Sinks Voltage vs Current