SNVSCE3B May   2023  – November 2023 LP5866T

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Multiplexing Matrix
      2. 7.3.2 Analog Dimming (Current Gain Control)
        1. 7.3.2.1 Global 3-Bits Maximum Current (MC) Setting
        2. 7.3.2.2 3 Groups of 7-Bits Color Current (CC) Setting
        3. 7.3.2.3 Individual 8-bit Dot Current (DC) Setting
      3. 7.3.3 PWM Dimming
        1. 7.3.3.1 Individual 8-Bit / 16-Bit PWM for Each LED Dot
        2. 7.3.3.2 Programmable Groups of 8-Bit PWM Dimming
        3. 7.3.3.3 8-Bit PWM for Global Dimming
      4. 7.3.4 ON and OFF Control
      5. 7.3.5 Data Refresh Mode
      6. 7.3.6 Full Addressable SRAM
      7. 7.3.7 Protections and Diagnostics
        1. 7.3.7.1 LED Open Detection
        2. 7.3.7.2 LED Short Detection
        3. 7.3.7.3 Thermal Shutdown
        4. 7.3.7.4 UVLO (Under Voltage Lock Out)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Interface Selection
      2. 7.5.2 I2C Interface
        1. 7.5.2.1 I2C Data Transactions
        2. 7.5.2.2 I2C Data Format
        3. 7.5.2.3 Multiple Devices Connection
      3. 7.5.3 Programming
        1. 7.5.3.1 SPI Data Transactions
        2. 7.5.3.2 SPI Data Format
        3. 7.5.3.3 Multiple Devices Connection
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Program Procedure
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 VDD Input Supply Recommendations
      2. 8.3.2 VLED Input Supply Recommendations
      3. 8.3.3 VIO Input Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.3.3 Multiple Devices Connection

The device enters into SPI mode if IFS is pulled high to VIO through a pullup resistor(4.7KΩ recommended). VIO_EN can either be connected with VIO power supply or GPIO. It’s suggested to put one 1nF cap as closer to VIO_EN pin as possible. In SPI mode host can address as many devices as there are follower select pins on host.

LP5866T SPI Multiple Devices Connection Figure 7-19 SPI Multiple Devices Connection