SLVSHI2A February   2024  – April 2024 LP5867

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7.     14
    8. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Multiplexing Matrix
      2. 7.3.2 Analog Dimming (Current Gain Control)
        1. 7.3.2.1 Global 3-Bits Maximum Current (MC) Setting
        2. 7.3.2.2 3 Groups of 7-Bits Color Current (CC) Setting
        3. 7.3.2.3 Individual 8-bit Dot Current (DC) Setting
      3. 7.3.3 PWM Dimming
        1. 7.3.3.1 Individual 8-Bit / 16-Bit PWM for Each LED Dot
        2. 7.3.3.2 Programmable Groups of 8-Bit PWM Dimming
        3. 7.3.3.3 8-Bit PWM for Global Dimming
      4. 7.3.4 ON and OFF Control
      5. 7.3.5 Data Refresh Mode
      6. 7.3.6 Full Addressable SRAM
      7. 7.3.7 Protections and Diagnostics
        1. 7.3.7.1 LED Open Detection
        2. 7.3.7.2 LED Short Detection
        3. 7.3.7.3 Thermal Shutdown
        4. 7.3.7.4 UVLO (Under Voltage Lock Out)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Interface Selection
      2. 7.5.2 I2C Interface
        1. 7.5.2.1 I2C Data Transactions
        2. 7.5.2.2 I2C Data Format
        3. 7.5.2.3 Multiple Devices Connection
      3. 7.5.3 Programming
        1. 7.5.3.1 SPI Data Transactions
        2. 7.5.3.2 SPI Data Format
        3. 7.5.3.3 Multiple Devices Connection
    6. 7.6 Register Maps
  9. 8 Register Maps
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Program Procedure
      4. 9.2.4 Application Performance Plots
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 VDD Input Supply Recommendations
      2. 9.3.2 VLED Input Supply Recommendations
      3. 9.3.3 VIO Input Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • YBH|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.2.1 Global 3-Bits Maximum Current (MC) Setting

The MC is used to set the maximum current IOUT_MAX for each current sink, and this current is the maximum peak current for each LED dot. The MC can be set with 7 steps from 3 mA to 50 mA. When the device is powered on, the MC data is set to default value, which is 15 mA.

For data refresh Mode 1, MC data is effective immediately after new data is updated. For Mode 2 and Mode 3, to avoid unexpected MC data change during high speed data refreshing, MC data must be changed when all channels are off and new MC data is only updated when the 'Chip_EN' bit in Chip_en register is set to 0, and after the 'Chip_EN' returns to 1, the new MC data is effective. 'Down_Deghost' and 'Up_Deghost' in Dev_config3 work in the similar way with MC.

Table 7-1 Maximum Current (MC) Register Setting
3-BITS MAXIMUM_CURRENT REGISTERIOUT_MAX
BinaryDecimalmA
00003
00115
010210
011 (Default)3 (Default)15 (Default)
100420
101530
110640
111750