SLVSHI2A February   2024  – April 2024 LP5867

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7.     14
    8. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Multiplexing Matrix
      2. 7.3.2 Analog Dimming (Current Gain Control)
        1. 7.3.2.1 Global 3-Bits Maximum Current (MC) Setting
        2. 7.3.2.2 3 Groups of 7-Bits Color Current (CC) Setting
        3. 7.3.2.3 Individual 8-bit Dot Current (DC) Setting
      3. 7.3.3 PWM Dimming
        1. 7.3.3.1 Individual 8-Bit / 16-Bit PWM for Each LED Dot
        2. 7.3.3.2 Programmable Groups of 8-Bit PWM Dimming
        3. 7.3.3.3 8-Bit PWM for Global Dimming
      4. 7.3.4 ON and OFF Control
      5. 7.3.5 Data Refresh Mode
      6. 7.3.6 Full Addressable SRAM
      7. 7.3.7 Protections and Diagnostics
        1. 7.3.7.1 LED Open Detection
        2. 7.3.7.2 LED Short Detection
        3. 7.3.7.3 Thermal Shutdown
        4. 7.3.7.4 UVLO (Under Voltage Lock Out)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Interface Selection
      2. 7.5.2 I2C Interface
        1. 7.5.2.1 I2C Data Transactions
        2. 7.5.2.2 I2C Data Format
        3. 7.5.2.3 Multiple Devices Connection
      3. 7.5.3 Programming
        1. 7.5.3.1 SPI Data Transactions
        2. 7.5.3.2 SPI Data Format
        3. 7.5.3.3 Multiple Devices Connection
    6. 7.6 Register Maps
  9. 8 Register Maps
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Program Procedure
      4. 9.2.4 Application Performance Plots
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 VDD Input Supply Recommendations
      2. 9.3.2 VLED Input Supply Recommendations
      3. 9.3.3 VIO Input Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • YBH|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC LP5867 UNIT
YBH (DSBGA)
24 PINS
RθJA Junction-to-ambient thermal resistance 65.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.2 °C/W
RθJB Junction-to-board thermal resistance 15.5 °C/W
ΨJT Junction-to-top characterization parameter 0.1 °C/W
ΨJB Junction-to-board characterization parameter 15.3 °C/W