SNVSCE2B
May 2023 – November 2023
LP5868T
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
14
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Time-Multiplexing Matrix
7.3.2
Analog Dimming (Current Gain Control)
7.3.2.1
Global 3-Bits Maximum Current (MC) Setting
7.3.2.2
3 Groups of 7-Bits Color Current (CC) Setting
7.3.2.3
Individual 8-bit Dot Current (DC) Setting
7.3.3
PWM Dimming
7.3.3.1
Individual 8-Bit / 16-Bit PWM for Each LED Dot
7.3.3.2
Programmable Groups of 8-Bit PWM Dimming
7.3.3.3
8-Bit PWM for Global Dimming
7.3.4
ON and OFF Control
7.3.5
Data Refresh Mode
7.3.6
Full Addressable SRAM
7.3.7
Protections and Diagnostics
7.3.7.1
LED Open Detection
7.3.7.2
LED Short Detection
7.3.7.3
Thermal Shutdown
7.3.7.4
UVLO (Under Voltage Lock Out)
7.4
Device Functional Modes
7.5
Programming
7.5.1
Interface Selection
7.5.2
I2C Interface
7.5.2.1
I2C Data Transactions
7.5.2.2
I2C Data Format
7.5.2.3
Multiple Devices Connection
7.5.3
Programming
7.5.3.1
SPI Data Transactions
7.5.3.2
SPI Data Format
7.5.3.3
Multiple Devices Connection
7.6
Register Maps
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Application
8.2.2
Design Requirements
8.2.3
Detailed Design Procedure
8.2.3.1
Program Procedure
8.2.4
Application Performance Plots
8.3
Power Supply Recommendations
8.3.1
VDD Input Supply Recommendations
8.3.2
VLED Input Supply Recommendations
8.3.3
VIO Input Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Receiving Notification of Documentation Updates
9.2
Support Resources
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RKP|40
MPQF261B
Thermal pad, mechanical data (Package|Pins)
RKP|40
QFND309E
Orderable Information
snvsce2b_oa
snvsce2b_pm
9.5
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.