SNVSCE2B
May 2023 – November 2023
LP5868T
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
14
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Time-Multiplexing Matrix
7.3.2
Analog Dimming (Current Gain Control)
7.3.2.1
Global 3-Bits Maximum Current (MC) Setting
7.3.2.2
3 Groups of 7-Bits Color Current (CC) Setting
7.3.2.3
Individual 8-bit Dot Current (DC) Setting
7.3.3
PWM Dimming
7.3.3.1
Individual 8-Bit / 16-Bit PWM for Each LED Dot
7.3.3.2
Programmable Groups of 8-Bit PWM Dimming
7.3.3.3
8-Bit PWM for Global Dimming
7.3.4
ON and OFF Control
7.3.5
Data Refresh Mode
7.3.6
Full Addressable SRAM
7.3.7
Protections and Diagnostics
7.3.7.1
LED Open Detection
7.3.7.2
LED Short Detection
7.3.7.3
Thermal Shutdown
7.3.7.4
UVLO (Under Voltage Lock Out)
7.4
Device Functional Modes
7.5
Programming
7.5.1
Interface Selection
7.5.2
I2C Interface
7.5.2.1
I2C Data Transactions
7.5.2.2
I2C Data Format
7.5.2.3
Multiple Devices Connection
7.5.3
Programming
7.5.3.1
SPI Data Transactions
7.5.3.2
SPI Data Format
7.5.3.3
Multiple Devices Connection
7.6
Register Maps
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Application
8.2.2
Design Requirements
8.2.3
Detailed Design Procedure
8.2.3.1
Program Procedure
8.2.4
Application Performance Plots
8.3
Power Supply Recommendations
8.3.1
VDD Input Supply Recommendations
8.3.2
VLED Input Supply Recommendations
8.3.3
VIO Input Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Receiving Notification of Documentation Updates
9.2
Support Resources
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RKP|40
MPQF261B
Thermal pad, mechanical data (Package|Pins)
RKP|40
QFND309E
Orderable Information
snvsce2b_oa
snvsce2b_pm
1
Features
LED matrix topology:
18
constant current sinks with
8
scan switches for
144
LED dots
Configurable for 1 to
8
scan switches
Operating voltage range:
V
CC
/V
LED
range: 2.7V to 5.5V
Logic pins compatible with 1.8V, 3.3V, and 5V
18
constant current sinks with high precision:
100mA
per current sink when V
CC
≥ 3.3V
Device-to-device error: ±5%
Channel-to-channel error: ±5%
Phase-shift for balanced transient power
Ultra-low power consumption:
Shutdown mode: I
CC
≤ 1μA when EN = Low
Standby mode: I
CC
≤ 10μA when EN = High and CHIP_EN = 0 (data retained)
Active mode: I
CC
=
5mA
(typ.) when channel current =
12.5mA
Flexible dimming options:
Individual ON/OFF control for each LED dot
Analog dimming (current gain control)
Global 7-step Maximum Current (MC) setting for all LED dots
3 groups of 7-bit Color Current (CC) RGB setting
Individual 8-bit Dot Current (DC) setting for each LED dot
PWM dimming with audible-noise-free frequency
Global 8-bit PWM dimming for all LED dots
3 programmable groups of 8-bit PWM dimming for LED dot arbitrary mapping
Individual 8-bit or 16-bit PWM dimming for each LED dot
Full addressable SRAM to minimize data traffic
Individual LED dot open/short detection
De-ghosting and low brightness compensation
Interface options:
1MHz (max.) I
2
C interface when IFS = Low
12MHz (max.) SPI interface when IFS = High