SNVSCE2B May   2023  – November 2023 LP5868T

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7.     14
    8. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Multiplexing Matrix
      2. 7.3.2 Analog Dimming (Current Gain Control)
        1. 7.3.2.1 Global 3-Bits Maximum Current (MC) Setting
        2. 7.3.2.2 3 Groups of 7-Bits Color Current (CC) Setting
        3. 7.3.2.3 Individual 8-bit Dot Current (DC) Setting
      3. 7.3.3 PWM Dimming
        1. 7.3.3.1 Individual 8-Bit / 16-Bit PWM for Each LED Dot
        2. 7.3.3.2 Programmable Groups of 8-Bit PWM Dimming
        3. 7.3.3.3 8-Bit PWM for Global Dimming
      4. 7.3.4 ON and OFF Control
      5. 7.3.5 Data Refresh Mode
      6. 7.3.6 Full Addressable SRAM
      7. 7.3.7 Protections and Diagnostics
        1. 7.3.7.1 LED Open Detection
        2. 7.3.7.2 LED Short Detection
        3. 7.3.7.3 Thermal Shutdown
        4. 7.3.7.4 UVLO (Under Voltage Lock Out)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Interface Selection
      2. 7.5.2 I2C Interface
        1. 7.5.2.1 I2C Data Transactions
        2. 7.5.2.2 I2C Data Format
        3. 7.5.2.3 Multiple Devices Connection
      3. 7.5.3 Programming
        1. 7.5.3.1 SPI Data Transactions
        2. 7.5.3.2 SPI Data Format
        3. 7.5.3.3 Multiple Devices Connection
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Program Procedure
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 VDD Input Supply Recommendations
      2. 8.3.2 VLED Input Supply Recommendations
      3. 8.3.3 VIO Input Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±3000 V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.