SNVS358R July   2005  – June 2016 LP5900

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Output and Input Capacitor, Recommended Specifications
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 No-Load Stability
      2. 7.3.2 Enable Control
      3. 7.3.3 Low Noise Output
      4. 7.3.4 Thermal-Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with Enable Control
      2. 7.4.2 Operation with Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation
        2. 8.2.2.2 External Capacitors
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
          3. 8.2.2.2.3 Capacitor Characteristics
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 DSBGA Mounting
    4. 10.4 DSBGA Light Sensitivity
    5. 10.5 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(3)(2)
MIN MAX UNIT
Input voltage, VIN –0.3 6 V
Output voltage, VOUT –0.3 VIN + 0.3
Enable input voltage, VEN –0.3 VIN + 0.3
Continuous power dissipation(4) Internally Limited
Junction temperature, TJMAX 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) All voltages are with respect to the potential at the GND pin.
(4) Internal thermal shutdown circuitry protects the device from permanent damage.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage, VIN 2.5 5.5 V
Enable voltage, VEN 0 VIN + 0.3 V
Output current, IOUT(2) 0 150 mA
Junction temperature, TJ –40 125 °C
Ambient temperature, TA(2) –40 85 °C
(1) All voltages are with respect to the potential at the GND pin.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See Application and Implementation.

6.4 Thermal Information

THERMAL METRIC(1) LP5900 UNIT
NGF YZR/YPF
6 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 79.8 177.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 84.4 0.7 °C/W
RθJB Junction-to-board thermal resistance 20.4 35.6 °C/W
ψJT Junction-to-top characterization parameter 2.6 5.8 °C/W
ψJB Junction-to-board characterization parameter 20.3 35.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 11.2 — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise noted, specifications apply in Figure 16 with: VIN = VOUT (NOM) + 1 V, VEN = 1.2 V, CIN = COUT = 0.47 μF, IOUT = 1 mA.(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage 2.5 5.5 V
ΔVOUT Output voltage tolerance VIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mA to 150 mA,
–40°C ≤ TJ ≤ 125°C		 −2% 2%
Line regulation VIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mA 0.05 %V
Load regulation IOUT = 1 mA to 150 mA 0.001 %mA
ILOAD Load current  See(3) mA
Maximum output current –40°C ≤ TJ ≤ 125°C 150
IQ Quiescent current(4) VEN = 1.2 V, IOUT = 0 mA 25 µA
VEN = 1.2 V, IOUT = 0 mA, –40°C ≤ TJ ≤ 125°C 50
VEN = 1.2 V, IOUT = 150 mA 160
VEN = 1.2 V, IOUT = 150 mA, –40°C ≤ TJ ≤ 125°C 230
VEN = 0.3 V (disabled) 0.003
VEN = 0.3 V (disabled, –40°C ≤ TJ ≤ 125°C 1
IG Ground current(5) IOUT = 0 mA (VOUT = 2.5 V) 30 µA
VDO Dropout voltage(6) IOUT = 150 mA 80 mV
IOUT = 150 mA, –40°C ≤ TJ ≤ 125°C 150
ISC Short-circuit current limit(7) 300 mA
PSRR Power supply rejection ratio(8) f = 100 Hz, IOUT = 150 mA 85 dB
f = 1 kHz, IOUT = 150 mA 75
f = 10 kHz, IOUT = 150 mA 65
f = 50 kHz, IOUT = 150 mA 52
f = 100 kHz, IOUT = 150 mA 40
en Output noise voltage(8) BW = 10 Hz to 100 kHz, VIN = 4.2 V IOUT = 0 mA 7 μVRMS
IOUT = 1 mA 10
IOUT = 150 mA 6.5
TSHUTDOWN Thermal shutdown Temperature 160 ºC
Hysteresis 20
LOGIN INPUT THRESHOLDS
VIL Low input threshold (VEN) VIN = 2.5 V to 5.5 V, –40°C ≤ TJ ≤ 125°C 0.4 V
VIH High input threshold (VEN) VIN = 2.5 V to 5.5 V, –40°C ≤ TJ ≤ 125°C 1.2 V
IEN Input current at EN pin(9) VEN = 5.5 V and VIN = 5.5 V 5.5 μA
VEN = 0 V and VIN = 5.5 V 0.001
TRANSIENT CHARACTERISTICS
ΔVOUT Line transient(8) VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 μs, IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C −2 mV
VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V) in 30 μs, IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C 2
Load transient(8) IOUT = 1 mA to 150 mA in 10 μs, –40°C ≤ TJ ≤ 125°C −110 mV
IOUT = 150 mA to 1 mA in 10 μs, –40°C ≤ TJ ≤ 125°C 50
Overshoot on start-up(8) –40°C ≤ TJ ≤ 125°C 20 mV
Turnon time To 95% of VOUT(NOM) 150 300 μs
(1) All voltages are with respect to the potential at the GND pin.
(2) Minimum and Maximum limits are specified by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely norm.
(3) The device maintains a stable, regulated output voltage without a load current.
(4) Quiescent current is defined here as the difference in current between the input voltage source and the load at the OUT pin.
(5) Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device.
(6) Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its nominal value. This parameter only applies to output voltages above 2.5 V.
(7) Short-circuit current is measured with OUT pulled to 0 V and IN worst case = 6 V.
(8) This specification is specified by design.
(9) There is a 1-MΩ resistor between EN pin and ground on the device.

6.6 Output and Input Capacitor, Recommended Specifications(1)

PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
CIN Input capacitance Capacitance for stability 0.47 µF
Capacitance for stability, –40°C ≤ TJ ≤ 125°C 0.33
COUT Output capacitance Capacitance for stability 0.47
Capacitance for stability, –40°C ≤ TJ ≤ 125°C 0.33 10
ESR Output/Input capacitance 5 500 mΩ
(1) The minimum capacitance must be greater than 0.33 µF over the full range of operating conditions. The capacitor tolerance must be 30% or better over the full temperature range. The full range of operating conditions for the capacitor in the application should be considered during device selection to ensure this minimum capacitance specification is met. TI recommends X7R capacitors; however, capacitor types X5R, Y5V and Z5U may be used with consideration of the application and conditions.

6.7 Typical Characteristics

Unless otherwise specified, CIN = COUT = 0.47 µF, VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA , T A = 25°C.
LP5900 20144157.png Figure 1. Output Noise Density
LP5900 20144159.png Figure 3. Power Supply Rejection Ratio
LP5900 20144151.png Figure 5. Ground Current vs VIN, I LOAD = 0 mA
LP5900 20144153.png Figure 7. Ground Current vs VIN, I LOAD = 100 mA
LP5900 20144148.png Figure 9. Short-Circuit Current
LP5900 20144155.png Figure 11. Line Transient
LP5900 20144145.png Figure 13. Enable Start-up Time, (IOUT= 100 mA, VOUT = 2.8 V)
LP5900 20144105.png Figure 15. Dropout Over Temperature (100 mA)
LP5900 20144158.png Figure 2. Power Supply Rejection Ratio
LP5900 20144154.png Figure 4. Output Voltage Change vs Temperature
LP5900 20144152.png Figure 6. Ground Current vs VIN, I LOAD = 1 mA
LP5900 20144150.png Figure 8. Ground Current vs Load Current
LP5900 20144149.png Figure 10. Load Transient
LP5900 20144144.png Figure 12. Enable Start-up Time, (IOUT= 1 mA, VOUT = 2.8 V)
LP5900 20144146.png Figure 14. Enable Start-up Time, (IOUT= 1 mA, VOUT = 2.8 V)