SNVSA34E September   2014  – December 2019 LP5907-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Output and Input Capacitors
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LP5907-Q1 Voltage Options
      2. 7.3.2 Enable (EN)
      3. 7.3.3 Low Output Noise
      4. 7.3.4 Output Automatic Discharge
      5. 7.3.5 Remote Output Capacitor Placement
      6. 7.3.6 Thermal Overload Protection (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation and Device Operation
        2. 8.2.2.2 External Capacitors
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 Capacitor Characteristics
        6. 8.2.2.6 Remote Capacitor Operation
        7. 8.2.2.7 No-Load Stability
        8. 8.2.2.8 Enable Control
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from D Revision (December 2018) to E Revision

  • Changed device status from advance information to production data for DQN (X2SON) packageGo
  • Changed DQN values and added RθJC(top) parameter to Thermal Information tableGo
  • Added X2SON rows to ΔVOUT parameter in Electrical Characteristics tableGo

Changes from C Revision (May 2018) to D Revision

  • Added DQN (X2SON) package to document as Preview Go
  • Added Layout Example for the DQN Package figureGo

Changes from B Revision (September 2016) to C Revision

  • Added ESD classification level sub-bullets to Features section Go
  • Changed DBV values in Thermal Information table Go
  • Deleted footnote 1 from Thermal Information table Go
  • Added Overshoot on start-up with EN row to Electrical Characteristics table Go
  • Changed Device Comparison table: changed table title, added new rows and new data, moved to new sub-section Go

Changes from A Revision (June 2016) to B Revision

  • Changed wording of title Go
  • Changed "Low Output Voltage Noise: < 10 µVRMS" to "Low Output Voltage Noise: < 6.5 µVRMS"Go
  • Changed items listed in ApplicationsGo
  • Changed wording of first sentence of DescriptionGo

Changes from * Revision (September 2014) to A Revision

  • Added Features bullets re: automotive Go
  • Added top navigator icon for TI DesignsGo
  • Changed " linear regulator" to "LDO"Go
  • Changed storage temperature from Handling Ratings to Abs Max table; replaced Handling Ratings with ESD Ratings per new format Go