SNVS798P April   2012  – January 2024 LP5907

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Output and Input Capacitors
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable (EN)
      2. 6.3.2 Low Output Noise
      3. 6.3.3 Output Automatic Discharge
      4. 6.3.4 Remote Output Capacitor Placement
      5. 6.3.5 Thermal Overload Protection (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Enable (EN)
      2. 6.4.2 Minimum Operating Input Voltage (VIN)
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Power Dissipation and Device Operation
        3. 7.2.2.3 External Capacitors
        4. 7.2.2.4 Input Capacitor
        5. 7.2.2.5 Output Capacitor
        6. 7.2.2.6 Capacitor Characteristics
        7. 7.2.2.7 Remote Capacitor Operation
        8. 7.2.2.8 No-Load Stability
        9. 7.2.2.9 Enable Control
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 X2SON Mounting
        2. 7.4.1.2 DSBGA Mounting
        3. 7.4.1.3 DSBGA Light Sensitivity
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Custom Design With WEBENCH® Tools
      2. 8.1.2 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YKM|4
  • DBV|5
  • DQN|4
  • YKG|4
  • YKE|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.5 Thermal Overload Protection (TSD)

Thermal shutdown disables the output when the junction temperature rises to approximately 160°C, which allows the device to cool. When the junction temperature cools to approximately 145°C, the output circuitry enables. Based on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit can cycle on and off. This thermal cycling limits the dissipation of the regulator, and protects the regulator from damage as a result of overheating.

The thermal shutdown circuitry of the LP5907 is designed to protect against temporary thermal overload conditions. The TSD circuitry is not intended to replace proper heat-sinking. Continuously running the LP5907 into thermal shutdown can degrade device reliability.