SNVSA91F September   2015  – April 2021 LP5910

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 No-Load Stability
      2. 7.3.2 Thermal Overload Protection
      3. 7.3.3 Short-Circuit Protection
      4. 7.3.4 Output Automatic Discharge
      5. 7.3.5 Reverse Current Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Input Capacitor
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Capacitor Characteristics
        5. 8.2.2.5 Remote Capacitor Operation
        6. 8.2.2.6 No-Load Stability
        7. 8.2.2.7 Enable Control
        8. 8.2.2.8 Power Dissipation
        9. 8.2.2.9 Estimating Junction Temperature
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 DSBGA Mounting
      2. 10.1.2 DSBGA Light Sensitivity
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-C3206083-9688-47B7-9BC4-9F89FEF3FD80-low.gifFigure 5-1 YKA Package,4-Pin Ultra-Thin DSBGA, Top View
GUID-38EA61F5-C4A9-43F1-B8DB-E5AFD385975A-low.gifFigure 5-3 DRV Package,6-Pin WSON With Thermal Pad,Top View
GUID-42FE85A9-9793-4F90-BB35-C1F38151B231-low.gifFigure 5-2 YKA Package,4-Pin Ultra-Thin DSBGA, Bottom View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME DSBGA WSON
EN B1 4 I Enable input; disables the regulator when logic low. Enables the regulator when logic high. An internal 1-MΩ pull down resistor connects this input to ground.
GND B2 5 — Common ground
IN A1 6 I Voltage supply input. A 1-μF capacitor must be connected at this input.
NC — 2, 3 — No internal connection. Connect to ground or leave open.
OUT A2 1 O Voltage output. A 1-µF low-ESR capacitor must be connected from this pin to the GND pin. Connect this output to the load circuit.
Exposed Pad — Thermal Pad — The exposed thermal pad on the bottom of the package must be connected to a copper area under the package on the PCB. Connect to ground potential or leave floating. Do not connect to any potential other than the same ground potential seen at device pin 5 (GND). See the Section 8.2.2.8 section for more information.