SNVSBA3 December 2020 LP875761-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | LP875761-Q1 | UNIT | |
---|---|---|---|
RNF (VQFN-HR) | |||
26 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 34.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 16.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 4.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 4.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.4 | °C/W |