SNVSBP2 February   2020 LP8758-E3

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Buck Information
        1. 7.1.1.1 Operating Modes
        2. 7.1.1.2 Programmability
        3. 7.1.1.3 Features
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overview
        1. 7.3.1.1 Transition between PWM and PFM Modes
        2. 7.3.1.2 Buck Converter Load Current Measurement
        3. 7.3.1.3 Spread-Spectrum Mode
      2. 7.3.2 Power-Up
      3. 7.3.3 Regulator Control
        1. 7.3.3.1 Enabling and Disabling
        2. 7.3.3.2 Changing Output Voltage
      4. 7.3.4 Device Reset Scenarios
      5. 7.3.5 Diagnosis and Protection Features
        1. 7.3.5.1 Warnings for Diagnosis (Interrupt)
          1. 7.3.5.1.1 Output Current Limit
          2. 7.3.5.1.2 Thermal Warning
        2. 7.3.5.2 Protection (Regulator Disable)
          1. 7.3.5.2.1 Short-Circuit and Overload Protection
          2. 7.3.5.2.2 Thermal Shutdown
        3. 7.3.5.3 Fault (Power Down)
          1. 7.3.5.3.1 Undervoltage Lockout
      6. 7.3.6 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  OTP_REV
        2. 7.6.1.2  BUCK0_CTRL1
        3. 7.6.1.3  BUCK0_CTRL2
        4. 7.6.1.4  BUCK1_CTRL1
        5. 7.6.1.5  BUCK1_CTRL2
        6. 7.6.1.6  BUCK2_CTRL1
        7. 7.6.1.7  BUCK2_CTRL2
        8. 7.6.1.8  BUCK3_CTRL1
        9. 7.6.1.9  BUCK3_CTRL2
        10. 7.6.1.10 BUCK0_VOUT
        11. 7.6.1.11 BUCK0_FLOOR_VOUT
        12. 7.6.1.12 BUCK1_VOUT
        13. 7.6.1.13 BUCK1_FLOOR_VOUT
        14. 7.6.1.14 BUCK2_VOUT
        15. 7.6.1.15 BUCK2_FLOOR_VOUT
        16. 7.6.1.16 BUCK3_VOUT
        17. 7.6.1.17 BUCK3_FLOOR_VOUT
        18. 7.6.1.18 BUCK0_DELAY
        19. 7.6.1.19 BUCK1_DELAY
        20. 7.6.1.20 BUCK2_DELAY
        21. 7.6.1.21 BUCK3_DELAY
        22. 7.6.1.22 RESET
        23. 7.6.1.23 CONFIG
        24. 7.6.1.24 INT_TOP
        25. 7.6.1.25 INT_BUCK_0_1
        26. 7.6.1.26 INT_BUCK_2_3
        27. 7.6.1.27 TOP_STAT
        28. 7.6.1.28 BUCK_0_1_STAT
        29. 7.6.1.29 BUCK_2_3_STAT
        30. 7.6.1.30 TOP_MASK
        31. 7.6.1.31 BUCK_0_1_MASK
        32. 7.6.1.32 BUCK_2_3_MASK
        33. 7.6.1.33 SEL_I_LOAD
        34. 7.6.1.34 I_LOAD_2
        35. 7.6.1.35 I_LOAD_1
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Application Components
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Input Capacitor Selection
          3. 8.2.2.1.3 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1.2 Buck Converter Load Current Measurement

Buck load current can be monitored via I2C registers. The monitored buck converter core is selected with the SEL_I_LOAD.LOAD_CURRENT_BUCK_SELECT[1:0] register bits. A write to this selection register starts a current measurement sequence. The measurement sequence is typically 50 µs long. The LP8758-E3 device can be configured to give out an interrupt INT_TOP.I_LOAD_READY after the load current measurement sequence is finished. Load current measurement interrupt can be masked with TOP_MASK.I_LOAD_READY_MASK bit. The measurement result can be read from registers I_LOAD_1 and I_LOAD_2. Register I_LOAD_1 bits BUCK_LOAD_CURRENT[7:0] give out the LSB bits and register I_LOAD_2 bits BUCK_LOAD_CURRENT[9:8] the MSB bits. The measurement result BUCK_LOAD_CURRENT[9:0] LSB is 20 mA, and maximum value of the measurement is 20.46 A.