SNVSA21G May   2014  – October 2017 LP8860-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Current Sinks Electrical Characteristics
    7. 7.7  Boost Converter Characteristics
    8. 7.8  Logic Interface Characteristics
    9. 7.9  VIN Undervoltage Protection (VIN_UVLO)
    10. 7.10 VDD Undervoltage Protection (VDD_UVLO)
    11. 7.11 VIN Overvoltage Protection (VIN_OVP)
    12. 7.12 VIN Overcurrent Protection (VIN_OCP)
    13. 7.13 Power-Line FET Control Electrical Characteristics
    14. 7.14 External Temp Sensor Control Electrical Characteristics
    15. 7.15 I2C Serial Bus Timing Parameters (SDA, SCLK)
    16. 7.16 SPI Timing Requirements
    17. 7.17 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Boost Controller
      2. 8.1.2 LED Output Configurations
      3. 8.1.3 Display Mode
      4. 8.1.4 Cluster Mode
      5. 8.1.5 Hybrid Dimming
      6. 8.1.6 Charge Pump and Square Waveform (SQW) Output
      7. 8.1.7 Power-Line FET
      8. 8.1.8 Protection Features
      9. 8.1.9 Advanced Thermal Protection Features
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clock Generation
        1. 8.3.1.1 LED PWM Clock Generation With VSYNC
        2. 8.3.1.2 LED PWM Frequency and Resolution
      2. 8.3.2 Brightness Control (Display Mode)
        1. 8.3.2.1 PWM Input Duty Cycle Based Control
        2. 8.3.2.2 Brightness Register Control
        3. 8.3.2.3 PWM Input Duty × Brightness Register
        4. 8.3.2.4 PWM-Input Direct Control
        5. 8.3.2.5 Brightness Slope
        6. 8.3.2.6 LED Dimming Methods
        7. 8.3.2.7 PWM Calculation Data Flow for Display Mode
      3. 8.3.3 LED Output Modes and Phase Shift PWM (PSPWM) Scheme
      4. 8.3.4 LED Current Setting
      5. 8.3.5 Cluster Mode
      6. 8.3.6 Boost Controller
      7. 8.3.7 Charge Pump
      8. 8.3.8 Powerline Control FET
      9. 8.3.9 Protection and Fault Detection Modes
        1. 8.3.9.1 LED Fault Comparators and Adaptive Boost Control
        2. 8.3.9.2 LED Current Dimming With Internal Temperature Sensor
        3. 8.3.9.3 LED Current Limitation With External NTC Sensor
        4. 8.3.9.4 LED Current Dimming With External NTC Sensor
        5. 8.3.9.5 Protection Feature and Fault Summary
    4. 8.4 Device Functional Modes
      1. 8.4.1 Standby Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 Fault Recovery State
      4. 8.4.4 Start-Up and Shutdown Sequences
    5. 8.5 Programming
      1. 8.5.1 EEPROM
      2. 8.5.2 Serial Interface
        1. 8.5.2.1 SPI Interface
        2. 8.5.2.2 I2C Serial Bus Interface
          1. 8.5.2.2.1 Interface Bus Overview
          2. 8.5.2.2.2 Data Transactions
          3. 8.5.2.2.3 Acknowledge Cycle
          4. 8.5.2.2.4 Acknowledge After Every Byte Rule
          5. 8.5.2.2.5 Addressing Transfer Formats
          6. 8.5.2.2.6 Control Register Write Cycle
          7. 8.5.2.2.7 Control Register Read Cycle
    6. 8.6 Register Maps
      1. 8.6.1 Register Bit Explanations
        1. 8.6.1.1  Display/Cluster1 Brightness Control MSB
        2. 8.6.1.2  Display/Cluster1 Brightness Control LSB
        3. 8.6.1.3  Display/Cluster1 Output Current MSB
        4. 8.6.1.4  Display/Cluster1 Output Current LSB
        5. 8.6.1.5  Cluster2 Brightness Control MSB
        6. 8.6.1.6  Cluster2 Brightness Control LSB
        7. 8.6.1.7  Cluster2 Output Current
        8. 8.6.1.8  Cluster3 Brightness Control MSB
        9. 8.6.1.9  Cluster3 Brightness Control LSB
        10. 8.6.1.10 Cluster3 Output Current
        11. 8.6.1.11 Cluster4 Brightness Control MSB
        12. 8.6.1.12 Cluster4 Brightness Control LSB
        13. 8.6.1.13 Cluster4 Output Current
        14. 8.6.1.14 Configuration
        15. 8.6.1.15 Status
        16. 8.6.1.16 Fault
        17. 8.6.1.17 LED Fault
        18. 8.6.1.18 Fault Clear
        19. 8.6.1.19 Identification
        20. 8.6.1.20 Temp MSB
        21. 8.6.1.21 Temp LSB
        22. 8.6.1.22 Display LED Current MSB
        23. 8.6.1.23 Display LED Current LSB
        24. 8.6.1.24 Display LED PWM MSB
        25. 8.6.1.25 Display LED PWM LSB
        26. 8.6.1.26 EEPROM Control
        27. 8.6.1.27 EEPROM Unlock Code
      2. 8.6.2 EEPROM Bit Explanations
        1. 8.6.2.1  EEPROM Register 0
        2. 8.6.2.2  EEPROM Register 1
        3. 8.6.2.3  EEPROM Register 2
        4. 8.6.2.4  EEPROM Register 3
        5. 8.6.2.5  EEPROM Register 4
        6. 8.6.2.6  EEPROM Register 5
        7. 8.6.2.7  EEPROM Register 6
        8. 8.6.2.8  EEPROM Register 7
        9. 8.6.2.9  EEPROM Register 8
        10. 8.6.2.10 EEPROM Register 9
        11. 8.6.2.11 EEPROM Register 10
        12. 8.6.2.12 EEPROM Register 11
        13. 8.6.2.13 EEPROM Register 12
        14. 8.6.2.14 EEPROM Register 13
        15. 8.6.2.15 EEPROM Register 14
        16. 8.6.2.16 EEPROM Register 15
        17. 8.6.2.17 EEPROM Register 16
        18. 8.6.2.18 EEPROM Register 17
        19. 8.6.2.19 EEPROM Register 18
        20. 8.6.2.20 EEPROM Register 19
        21. 8.6.2.21 EEPROM Register 20
        22. 8.6.2.22 EEPROM Register 21
        23. 8.6.2.23 EEPROM Register 22
        24. 8.6.2.24 EEPROM Register 23
        25. 8.6.2.25 EEPROM Register 24
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application for Display Backlight
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Inductor Selection
          2. 9.2.1.2.2  Output Capacitor Selection
          3. 9.2.1.2.3  Input Capacitor Selection
          4. 9.2.1.2.4  Charge Pump Output Capacitor
          5. 9.2.1.2.5  Charge Pump Flying Capacitor
          6. 9.2.1.2.6  Diode
          7. 9.2.1.2.7  Boost Converter Transistor
          8. 9.2.1.2.8  Boost Sense Resistor
          9. 9.2.1.2.9  Power Line Transistor
          10. 9.2.1.2.10 Input Current Sense Resistor
          11. 9.2.1.2.11 Filter Component Values
            1. 9.2.1.2.11.1 Critical Components for Design
        3. 9.2.1.3 Application Performance Plots
      2. 9.2.2 Low VDD Voltage and Combined Output Mode Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Performance Plots
      3. 9.2.3 High Output Voltage Application
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Performance Plots
      4. 9.2.4 High Output Current Application
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Performance Plots
      5. 9.2.5 Three-Channel Configuration Without Serial Interface
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
        3. 9.2.5.3 Application Performance Plots
      6. 9.2.6 Solution With Minimum External Components
        1. 9.2.6.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature
  • Input Voltage Operating Range 3 V to 48 V
  • Four High-Precision Current Sinks
    • Current Matching 0.5% (typical)
    • LED String Current up to 150 mA per Channel
    • Dimming Ratio > 13 000:1 With External PWM Brightness Control
    • 16-bit Dimming Control with SPI or I2C
    • Supports Display Mode (Global Dimming) and Cluster Mode (Independent Dimming)
  • Hybrid PWM and Current Dimming for Higher LED Drive Optical Efficiency
  • Synchronization for LED PWM Frequency
  • Boost Controller With Programmable Switching Frequency 100 kHz to 2.2 MHz and Spread-Spectrum Option for Lower EMI
  • Boost Synchronization Input
  • Power-Line FET Control for Inrush Current Protection and Standby Energy Saving
  • Automatic LED Current Reduction With External Temperature Sensor
  • Extensive Fault Diagnostics
  • Simplified Schematic

    LP8860-Q1 typapp_frnt_pg_snvsa21.gif

Applications

  • Backlight for:
    • Automotive Infotainment
    • Automotive Instrument Clusters
    • Smart Mirrors
    • Heads-Up Displays (HUD)
    • Central Information Displays (CID)
    • Audio-Video Navigation (AVN)

Description

The LP8860-Q1 is an automotive high-efficiency LED driver with boost controller. It has 4 high-precision current sinks that can be controlled by a PWM input signal, an SPI or I2C master, or both.

The boost converter has adaptive output voltage control based on the headroom voltages of the LED current sinks. This feature minimizes the power consumption by adjusting the voltage to the lowest sufficient level in all conditions. A wide-range adjustable frequency allows the LP8860-Q1 to avoid disturbance for AM radio band.

The LP8860-Q1 supports built-in hybrid PWM and current dimming, which reduces EMI, extends the LED lifetime, and increases the total optical efficiency. Phase-shift PWM reduces audible noise and output ripple.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
LP8860-Q1 HLQFP (32) 7.00 mm × 7.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

System Efficiency

LP8860-Q1 C001_SNVSA21.png

Revision History

Changes from F Revision (July 2017) to G Revision

  • Updated with more detailed package drawings Go

Changes from E Revision (November 2016) to F Revision

  • Changed placement of "7" data hold time in Figure 2 Go
  • Deleted "The LP8860-Q1 doesn’t support incremental addressing." after Table 20 Go
  • Changed "short" to "open" in DRV_HEADER[2:0] row, EEPROM Register 4Go

Changes from D Revision (September 2016) to E Revision

  • Deleted 4-A row from VOCP in VIN Overcurrent Protection (VIN_OCP) tableGo
  • Changed "+ 150 mA" to "× 150 mA" in eq. 8 Go
  • Deleted "01/4A" row from Input voltage overcurrent protection in Table 16Go
  • Deleted duplicate of Figure 42 "State Diagram" Go
  • Changed "open" to "short" in DRV_LED_FAULT_THR[1:0] row, EEPROM Register 4Go
  • Changed "nit" to "not" - correct typoGo
  • Deleted "01 = 4 A" from PL_SD_LEVEL[1:0] in EEPROM Register 10Go
  • Updated orderable options in POA Go
  • Added pre-prod "R" orderable option in POA Go

Changes from C Revision (December 2015) to D Revision

  • Changed title of data sheet Go
  • Changed slight modification to wording of "Features" bulletsGo
  • Deleted "Safety and" Go
  • Changed "Tolerance Features" to "Diagnostics"Go
  • Deleted "SPI or I2C Interface"Go
  • Added additional Applications Go
  • Changed "The high switching" to "A wide-range adjustable"Go
  • Deleted some wording in Description to make it more succinct; rewrite last sentenceGo
  • Added Device Comparison tableGo
  • Deleted Table 19 "Default EEPROM Context" - this information now in SNVA757, available in mysecureSW only Go

Changes from B Revision (March 2015) to C Revision

  • Added Features bullets re: Automotive Go
  • Changed "safety" to "fault detection"Go
  • Changed "up to 40V" to "Up to 48V" in Simplified Schematic Go
  • Changed SPI Write Cycle and SPI Read Cycle diagrams Go

Changes from A Revision (June 2014) to B Revision

  • Changed EXT_TEMP_MINUS[1:0] from "2, 6, 10, 14 μA" to "1, 5, 9, 13 µA"Go
  • Changed values for EXT_TEMP_MINUS from "2, 6, 10, 14 µA" to '1, 5, 9, 13 µA"Go
  • Added Documentation Support section Go

Changes from * Revision (May 2014) to A Revision

  • Changed first sentence in paragraph beginning "EEPROM bits are intended to be set..." to 2 separate sentences Go