The LP8863-Q1 is an automotive high-efficiency LED driver with boost controller. The six high-precision current sinks support phase shifting that is automatically adjusted based on the number of channels in use. Current sink brightness can be controlled individually and globally through the SPI or I2C interface; brightness can also be globally controlled with PWM input.
The boost controller has adaptive output voltage control based on the headroom voltages of the LED current sinks. This feature minimizes the power consumption by adjusting the voltage to the lowest sufficient level in all conditions. A wide-range adjustable frequency allows the LP8863-Q1 to avoid disturbance for AM radio band.
The LP8863-Q1 supports built-in hybrid PWM and current dimming, which reduces EMI, extends the LED lifetime, and increases the total optical efficiency.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
LP8863-Q1 | HTSSOP (38) | 9.70 mm × 4.40 mm |
Changes from A Revision (June 2017) to B Revision
Changes from * Revision (March 2017) to A Revision
LP8863-Q1 | LP8860-Q1 | LP8862-Q1 | LP8861-Q1 | TPS61193-Q1 | TPS61194-Q1 | TPS61196-Q1 | |
VIN range | 3 V to 48 V | 3 V to 48 V | 4.5 V to 45 V | 4.5 V to 45 V | 4.5 V to 45 V | 4.5 V to 45 V | 8 V to 30 V |
Number of LED channels | 6 | 4 | 2 | 4 | 3 | 4 | 6 |
LED current / channel | 150 mA | 150 mA | 160 mA | 100 mA | 100 mA | 100 mA | 200 mA |
I2C/SPI support | Yes | Yes | No | No | No | No | No |
SEPIC support | Yes | No | Yes | Yes | Yes | Yes | No |
PIN | TYPE | DESCRIPTION | |
NO. | NAME | ||
1 | VDD | Power | Power input for LDO, charge pump, and analog blocks - a 4.7–µF decoupling capacitor is recommended. |
2 | SD | Analog | Power line FET control. If unused, leave this pin floating. |
3 | VSENSE_N | Analog | Pin for input current sense. If input current sense is not used tie to VSENSE_P. |
4 | VSENSE_P | Analog | Pin for OVP/UVLO protection and input current sense. |
5 | C1N | Analog | Negative pin for charge pump flying capacitor. If feature not used, leave this pin floating. |
6 | C1P | Analog | Positive pin for charge pump flying capacitor. If feature not used, leave this pin floating. |
7 | CPUMP | Power | Charge pump output pin. If charge pump is not used connect to VDD. TI recommends a 10–µF decoupling capacitor. |
8 | CPUMP | Power | Charge pump output pin. If charge pump is not used connect to VDD. |
9 | GD | Analog | Gate driver output for boost FET |
10 | GD | Analog | Gate driver output for boost FET |
11 | PGND | Ground | Power ground |
12 | PGND | Ground | Power ground |
13 | ISNSGND | Ground | Current sense resistor GND of boost controller |
14 | ISNS | Analog | Boost current sense pin |
15 | FB | Analog | Boost feedback input |
16 | DISCHARGE | Analog | Boost output voltage discharge pin. Leave floating if unused. |
17 | LED5 | Analog | LED current sink output. If unused tie to ground. |
18 | LED4 | Analog | LED current sink output. If unused tie to ground. |
19 | LED3 | Analog | LED current sink output. If unused tie to ground. |
20 | LED2 | Analog | LED current sink output. If unused tie to ground. |
21 | LED1 | Analog | LED current sink output. If unused tie to ground. |
22 | LED0 | Analog | LED current sink output. If unused tie to ground. |
23 | ISET | Analog | LED current setting input |
24 | EN | Input | Enable input |
25 | VDDIO | Power | Supply input for digital IO pins - a 4.7–µF decoupling capacitor is recommended. |
26 | INT | Output | LP8863-Q1 device fault interrupt output, open drain. Requires an external pullup resistor to VDDIO - a 10-kΩ pullup resistor is recommended. |
27 | IFSEL | Input | Serial control interface selection: low = SPI, high = I2C |
28 | BST_SYNC | Input | Input for synchronizing boost. When synchronization is not used, connect this pin to ground to disable spread spectrum or to VDDIO to enable spread spectrum. |
29 | SDO_PWM | Input/Output | IFSEL=GND, slave data output for SPI. IFSEL=VDDIO, PWM input for brightness control. Tie to GND if unused. |
30 | SDI_SDA | Input | IFSEL=GND, slave data input for SPI; IFSEL=VDDIO, serial data for I2C |
31 | SCLK_SCL | Input | IFSEL=GND, serial clock for SPI; IFSEL=VDDIO, serial clock for I2C |
32 | SS_ADDRSEL | Input | IFSEL=GND, slave select for SPI; IFSEL=VDDIO, I2C address selection |
33 | BST_FSET | Analog | Resistor for setting boost FSW frequency. Do not leave floating. |
34 | PWM_FSET | Analog | Resistor for setting LED PWM frequency. Do not leave floating. |
35 | NC | N/A | No connect — leave floating. |
36 | NC | N/A | No connect — leave floating. |
37 | VLDO | Power | Internal 1.8-V LDO output. Connect bypass capacitor to this pin - a 10–µF decoupling capacitor is recommended. |
38 | GND | Ground | Ground for LDO — charge pump and analog blocks |
DAP | GND_LED | Ground | LED ground connection |
MIN | MAX | UNIT | ||
---|---|---|---|---|
Voltage on pins | V_SENSE_P, VSENSE_N, SD, LED0 to LED5, FB, DISCHARGE | -0.3 | 50 | V |
VDD, EN, ISNS | -0.3 | 5.5 | ||
Voltage on pins | VDDIO, SCLK_SCL, SDI_SDA, SDO_PWM, SS_ADDRSEL, INT, IFSEL, BST_FSET, PWM_FSET, ISET | -0.3 | 3.6 | V |
C1P, C1N, CPUMP(2), GD | -0.3 | 12 | ||
VLDO | -0.3 | 2 | ||
Thermal | Continuous power dissipation | Internally limited | Internally limited | |
Ambient temperature | -40 | 125 | °C | |
Junction temperature | -40 | 150 | °C | |
Maximum lead temperature (soldering) | 260 | °C | ||
Storage temperature, Tstg | -65 | 150 | °C |