SNVSAB6B
March 2017 – July 2018
LP8863-Q1
PRODUCTION DATA.
1
Features
2
Applications
3
Description
System Efficiency
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Protection Electrical Characteristics
7.7
LED Current Sink and LED PWM Electrical Characteristics
7.8
Power-Line FET and RISENSE Electrical Characteristics
7.9
Input PWM Electrical Characteristics
7.10
Boost Converter Electrical Characteristics
7.11
Oscillator
7.12
Charge Pump
7.13
Logic Interface Characteristics
7.14
Timing Requirements for SPI Interface
7.15
Timing Requirements for I2C Interface
7.16
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Control Interface
8.3.2
Boost Controller
8.3.2.1
Boost Adaptive Voltage Control
8.3.2.1.1
FB Divider Using Two-Resistor Method
8.3.2.1.2
FB Divider Using Three-Resistor Method
8.3.2.2
Boost Sync and Spread Spectrum
8.3.2.3
Boost Output Discharge
8.3.3
2X Charge Pump
8.3.4
1.8-V LDO
8.3.5
LED Current Sinks
8.3.5.1
LED Output Current Setting
8.3.5.2
LED Output PWM Clock Generation
8.3.5.3
LED Output String Configuration
8.3.5.3.1
Independent Cluster Brightness Control Mode
8.3.6
Brightness Control
8.3.6.1
Brightness Control Signal Path
8.3.6.2
Hybrid Dimming
8.3.6.3
Sloper
8.3.6.4
Dither
8.3.7
Die Temperature Read-Out and Thermal Window Detector
8.3.8
Protection and Fault Detections
8.3.8.1
LED Faults
8.3.8.2
Boost Faults
8.3.8.3
Power-Line Faults
8.3.8.4
VDD Undervoltage Fault
8.3.8.5
Thermal Shutdown
8.3.8.6
Overview of the Fault/Protection Schemes
8.4
Device Functional Modes
8.4.1
State Diagram
8.4.2
Shutdown
8.4.3
Device Initialization
8.4.4
Standby Mode
8.4.5
Power-line FET Soft Start
8.4.6
Boost Start-Up
8.4.7
Normal Mode
8.4.8
Discharge Mode
8.4.9
Fault Recovery
8.4.10
Latch Fault
8.4.11
Start-Up Sequence
8.4.12
Shutdown Sequence
8.5
Programming
8.5.1
Serial Interface Selection
8.5.2
SPI Interface
8.5.3
I2C-Compatible Interface
8.5.4
Programming Examples
8.5.4.1
General Configuration Registers
8.5.4.2
Clearing Fault Interrupts
8.5.4.3
Disabling Fault Interrupts
8.5.4.4
Diagnostic Registers
8.5.4.5
Cluster Mode Configuration and Control Registers
8.6
Register Maps
8.6.1
FullMap Registers
8.6.1.1
BL_MODE Register (Offset = 20h) [reset = 300h]
Table 14.
BL_MODE Register Field Descriptions
8.6.1.2
DISP_BRT Register (Offset = 28h) [reset = 0h]
Table 15.
DISP_BRT Register Field Descriptions
8.6.1.3
GROUPING1 Register (Offset = 30h) [reset = 0h]
Table 16.
GROUPING1 Register Field Descriptions
8.6.1.4
GROUPING2 Register (Offset = 32h) [reset = 0h]
Table 17.
GROUPING2 Register Field Descriptions
8.6.1.5
USER_CONFIG1 Register (Offset = 40h) [reset = 8B0h]
Table 18.
USER_CONFIG1 Register Field Descriptions
8.6.1.6
USER_CONFIG2 Register (Offset = 42h) [reset = 0h]
Table 19.
USER_CONFIG2 Register Field Descriptions
8.6.1.7
INTERRUPT_ENABLE_3 Register (Offset = 4Eh) [reset = 200Ah]
Table 20.
INTERRUPT_ENABLE_3 Register Field Descriptions
8.6.1.8
INTERRUPT_ENABLE_1 Register (Offset = 50h) [reset = A02Ah]
Table 21.
INTERRUPT_ENABLE_1 Register Field Descriptions
8.6.1.9
INTERRUPT_ENABLE_2 Register (Offset = 52h) [reset = 80h]
Table 22.
INTERRUPT_ENABLE_2 Register Field Descriptions
8.6.1.10
INTERRUPT_STATUS_1 Register (Offset = 54h) [reset = 0h]
Table 23.
INTERRUPT_STATUS_1 Register Field Descriptions
8.6.1.11
INTERRUPT_STATUS_2 Register (Offset = 56h) [reset = 0h]
Table 24.
INTERRUPT_STATUS_2 Register Field Descriptions
8.6.1.12
INTERRUPT_STATUS_3 Register (Offset = 58h) [reset = 0h]
Table 25.
INTERRUPT_STATUS_3 Register Field Descriptions
8.6.1.13
JUNCTION_TEMPERATURE Register (Offset = E8h) [reset = 100h]
Table 26.
JUNCTION_TEMPERATURE Register Field Descriptions
8.6.1.14
TEMPERATURE_LIMIT_HIGH Register (Offset = ECh) [reset = 7Dh]
Table 27.
TEMPERATURE_LIMIT_HIGH Register Field Descriptions
8.6.1.15
TEMPERATURE_LIMIT_LOW Register (Offset = EEh) [reset = 69h]
Table 28.
TEMPERATURE_LIMIT_LOW Register Field Descriptions
8.6.1.16
CLUSTER1_BRT Register (Offset = 13Ch) [reset = FFFFh]
Table 29.
CLUSTER1_BRT Register Field Descriptions
8.6.1.17
CLUSTER2_BRT Register (Offset = 148h) [reset = FFFFh]
Table 30.
CLUSTER2_BRT Register Field Descriptions
8.6.1.18
CLUSTER3_BRT Register (Offset = 154h) [reset = FFFFh]
Table 31.
CLUSTER3_BRT Register Field Descriptions
8.6.1.19
CLUSTER4_BRT Register (Offset = 160h) [reset = FFFFh]
Table 32.
CLUSTER4_BRT Register Field Descriptions
8.6.1.20
CLUSTER5_BRT Register (Offset = 16Ch) [reset = FFFFh]
Table 33.
CLUSTER5_BRT Register Field Descriptions
8.6.1.21
BRT_DB_CONTROL Register (Offset = 178h) [reset = 0h]
Table 34.
BRT_DB_CONTROL Register Field Descriptions
8.6.1.22
LED0_CURRENT Register (Offset = 1C2h) [reset = FFFh]
Table 35.
LED0_CURRENT Register Field Descriptions
8.6.1.23
LED1_CURRENT Register (Offset = 1C4h) [reset = FFFh]
Table 36.
LED1_CURRENT Register Field Descriptions
8.6.1.24
LED2_CURRENT Register (Offset = 1C6h) [reset = FFFh]
Table 37.
LED2_CURRENT Register Field Descriptions
8.6.1.25
LED3_CURRENT Register (Offset = 1C8h) [reset = FFFh]
Table 38.
LED3_CURRENT Register Field Descriptions
8.6.1.26
LED4_CURRENT Register (Offset = 1CAh) [reset = FFFh]
Table 39.
LED4_CURRENT Register Field Descriptions
8.6.1.27
LED5_CURRENT Register (Offset = 1CCh) [reset = FFFh]
Table 40.
LED5_CURRENT Register Field Descriptions
8.6.1.28
BOOST_CONTROL Register (Offset = 288h) [reset = 1C0h]
Table 41.
BOOST_CONTROL Register Field Descriptions
8.6.1.29
SHORT_THRESH Register (Offset = 28Ah) [reset = 2882h]
Table 42.
SHORT_THRESH Register Field Descriptions
8.6.1.30
FSM_DIAGNOSTICS Register (Offset = 2A4h) [reset = 0h]
Table 43.
FSM_DIAGNOSTICS Register Field Descriptions
8.6.1.31
PWM_INPUT_DIAGNOSTICS Register (Offset = 2A6h) [reset = 0h]
Table 44.
PWM_INPUT_DIAGNOSTICS Register Field Descriptions
8.6.1.32
PWM_OUTPUT_DIAGNOSTICS Register (Offset = 2A8h) [reset = 0h]
Table 45.
PWM_OUTPUT_DIAGNOSTICS Register Field Descriptions
8.6.1.33
LED_CURR_DIAGNOSTICS Register (Offset = 2AAh) [reset = 0h]
Table 46.
LED_CURR_DIAGNOSTICS Register Field Descriptions
8.6.1.34
ADAPT_BOOST_DIAGNOSTICS Register (Offset = 2ACh) [reset = 0h]
Table 47.
ADAPT_BOOST_DIAGNOSTICS Register Field Descriptions
8.6.1.35
AUTO_DETECT_DIAGNOSTICS Register (Offset = 2AEh) [reset = 0h]
Table 48.
AUTO_DETECT_DIAGNOSTICS Register Field Descriptions
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Full Feature Application for Display Backlight
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Inductor Selection
9.2.1.2.2
Output Capacitor Selection
9.2.1.2.3
Input Capacitor Selection
9.2.1.2.4
Charge Pump Output Capacitor
9.2.1.2.5
Charge Pump Flying Capacitor
9.2.1.2.6
Output Diode
9.2.1.2.7
Switching FET
9.2.1.2.8
Boost Sense Resistor
9.2.1.2.9
Power-Line FET
9.2.1.2.10
Input Current Sense Resistor
9.2.1.2.11
Feedback Resistor Divider
9.2.1.2.12
Critical Components for Design
9.2.1.3
Application Curves
9.2.2
Application With Basic/Minimal Operation
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.3
Application Curves
9.2.3
SEPIC Mode Application
9.2.3.1
Design Requirements
9.2.3.2
Detailed Design Procedure
9.2.3.2.1
Inductor Selection
9.2.3.2.2
Coupling Capacitor Selection
9.2.3.2.3
Output Capacitor Selection
9.2.3.2.4
Input Capacitor Selection
9.2.3.2.5
Charge Pump Output Capacitor
9.2.3.2.6
Charge Pump Flying Capacitor
9.2.3.2.7
Switching FET
9.2.3.2.8
Output Diode
9.2.3.2.9
Switching Sense Resistor
9.2.3.2.10
Power-Line FET
9.2.3.2.11
Input Current Sense Resistor
9.2.3.2.12
Feedback Resistor Divider
9.2.3.2.13
Critical Components for Design
9.2.3.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
Third-Party Products Disclaimer
12.2
Receiving Notification of Documentation Updates
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DCP|38
MPDS520B
Thermal pad, mechanical data (Package|Pins)
DCP|38
PPTD170A
Orderable Information
snvsab6b_oa
snvsab6b_pm
12.1
Device Support