SLVSH05 November   2023 LP8865U-Q1 , LP8865V-Q1 , LP8865W-Q1 , LP8865X-Q1 , LP8865Y-Q1 , LP8865Z-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4  Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adaptive Off-Time Current Mode Control
        1. 7.3.1.1 Switching Frequency Settings
        2. 7.3.1.2 Spread Spectrum
      2. 7.3.2 Setting LED Current
      3. 7.3.3 Internal Soft Start
      4. 7.3.4 Dimming Mode
        1. 7.3.4.1 PWM dimming
        2. 7.3.4.2 Analog dimming
        3. 7.3.4.3 Hybrid Dimming
        4. 7.3.4.4 Flexible Dimming
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Fault Protection
      7. 7.3.7 Thermal Foldback
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LP8865XQDMTRQ1 12-V Input, 0.5-A Output, 8-piece LED With Boost Topology
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Output Capacitor Selection
          4. 8.2.1.2.4 Sense Resistor Selection
          5. 8.2.1.2.5 Other External Components Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LP8865YQDMTRQ1 12-V Input, 0.5-A Output, 5-piece LED With Buck-Boost Topology
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Inductor Selection
          2. 8.2.2.2.2 Input Capacitor Selection
          3. 8.2.2.2.3 Output Capacitor Selection
          4. 8.2.2.2.4 Sense Resistor Selection
          5. 8.2.2.2.5 Other External Components Selection
        3. 8.2.2.3 Application Curves
      3. 8.2.3 LP8865ZQDMTRQ1 12-V Input, 1-A Output, 1-piece LED With Buck Topology
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Inductor Selection
          2. 8.2.3.2.2 Input Capacitor Selection
          3. 8.2.3.2.3 Output Capacitor Selection
          4. 8.2.3.2.4 Sense Resistor Selection
          5. 8.2.3.2.5 Other External Components Selection
        3. 8.2.3.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-5140BF05-AD8E-4222-B3A2-663C140B68AA-low.gifFigure 5-1 14-Pin Buck VSONTop View
GUID-3F8DD51E-B08C-47E6-BFDA-E844F50D80B9-low.gif

HVSSOP is product preview

Figure 5-2 12-Pin Buck HVSSOPTop View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
No. NAME
1 PGND G Power ground pin.
2 AGND G Analog ground pin.
3 VIN P Input power pin.
4 VCC P Internal LDO output pin. Connect with a 10-V, 1-uF capacitor to GND.
5 ADIM/HD I Analog dimming or hybrid dimming pin. Pull high for PWM dimming only, pull low for hybrid dimming, input PWM signal for analog dimming.
6 PWM/EN I PWM dimming or EN pin. Pull high for always on, pull low for disabling the device, input PWM signal for PWM dimming.
7 FAULT O Open drain output. Pull low when fault is detected.
8 TEMP I/O Thermal foldback pin. Put different resistor values to GND to set different thermal foldback behavior curves.
9 FSET I/O Switching frequency set pin, with range of 100 kHz ~ 2.2 MHz. Put different resistor values to GND for different switching frequencies.
10 COMP I/O Error-amilifier output. Connect capacitors to GND. Different capacitor values determine different softstart times and bandwidths.
11 UVP I Undervoltage detection pin. Put different resistor dividers to set the LED open detection thresholds.
12 CSP I LED current sense positive pin.
13 CSN I LED current sense negative pin.
14 SW P Switching node pin. Internally connected to the low-side MOSFET. Connect with the power inductor and the schottky diode.
Pad Thermal Pad G Power ground pin.
GUID-58608632-3C10-495F-BA29-C213439B5BA9-low.gifFigure 5-3 14-Pin Boost/Buck-Boost VSONTop View
GUID-5140BF05-AD8E-4222-B3A2-663C140B68AA-low.gif

HVSSOP is product preview

Figure 5-4 12-Pin Boost/Buck-Boost HVSSOPTop View
Table 5-2 Pin Functions for boost/buck-boost topology
PIN TYPE(1) DESCRIPTION
VSON Package NAME
1 PGND G Power ground pin.
2 AGND G Analog ground pin.
3 VIN P Input power pin.
4 VCC P Internal LDO output pin. Connect with a 10-V, 1-uF capacitor to GND.
5 ADIM/HD I Analog dimming or hybrid dimming pin. Pull high for PWM dimming only, pull low for hybrid dimming, input PWM signal for analog dimming.
6 PWM/EN I PWM dimming or EN pin. Pull high for always on, pull low for disabling the device, input PWM signal for PWM dimming.
7 FAULT O Open drain output. Pull low when fault is detected.
8 TEMP I/O Thermal foldback pin. Put different resistor values to GND to set different thermal foldback behavior curves.
9 FSET I/O Switching frequency set pin, with range of 100 kHz ~ 2.2 MHz. Put different resistor values to GND for different switching frequencies.
10 COMP I/O Error-amilifier output. Connect capacitors to GND. Different capacitor values determine different softstart times and bandwidths.
11 OVP I Overvoltage detection pin. Put different resistor dividers to set the LED open detection thresholds.
12 CSN I LED current sense negative pin.
13 CSP I LED current sense positive pin.
14 SW P Switching node pin. Internally connected to the low-side MOSFET. Connect with the power inductor and the schottky diode.
Pad Thermal Pad G Power ground pin.
(1) I = Input, O = Output, P = Supply, G = Ground