SDLS973 june   2023 LSF0101

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  LSF0101 AC Performance (Translating Down) Switching Characteristics , VCCB = 3.3 V
    7. 6.7  LSF0101 AC Performance (Translating Down) Switching Characteristics, VCCB = 2.5 V
    8. 6.8  LSF0101 AC Performance (Translating Up) Switching Characteristics, VCCB = 3.3 V
    9. 6.9  LSF0101 AC Performance (Translating Up) Switching Characteristics, VCCB = 2.5 V
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Auto Bidirectional Voltage Translation
      2. 8.3.2 Output Enable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Up and Down Translation
        1. 8.4.1.1 Up Translation
        2. 8.4.1.2 Down Translation
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Open-Drain Interface (I2C, PMBus, SMBus, and GPIO)
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
          2. 9.2.1.1.2 Bias Circuitry
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Bidirectional Translation
          2. 9.2.1.2.2 Pull-Up Resistor Sizing
          3. 9.2.1.2.3 Single Supply Translation
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Voltage Translation for Vref_B < Vref_A + 0.8 V
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Device Functional Modes

For each channel (n), when either the An or Bn port is LOW, the switch provides a low impedance path between the An and Bn ports; the corresponding Bn or An port will be pulled LOW. The low RON of the switch allows connections to be made with minimal propagation delay and signal distortion.

Table 8-1 provides a summary of device operation. For additional details on the functional operation of the LSF family of devices, see the Down Translation with the LSF Family and Up Translation with the LSF Family videos.

Table 8-2 Device Functionality
Signal Direction(1)Input StateSwitch StateFunctionality
B to A (Down Translation)B = LOWON
(Low Impedance)		A-side voltage is pulled low through the switch to the B-side voltage
B = HIGHOFF
(High Impedance)		A-side voltage is clamped at Vref_A (2)
A to B (Up Translation)A = LOWON
(Low Impedance)		B-side voltage is pulled low through the switch to the A-side voltage
A = HIGHOFF
(High Impedance)		B-side voltage is clamped at Vref_A and then pulled up to the VPU supply voltage
(1) The downstream channel should not be actively driven through a low impedance driver, or else bus contention may occur.
(2) The A-side can have a pullup to Vref_A for additional current drive capability or may also be pulled above Vref_A with a pullup resistor. Specifications in the Recommended Operating Conditions section should always be followed.