SDLS973 june   2023 LSF0101

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  LSF0101 AC Performance (Translating Down) Switching Characteristics , VCCB = 3.3 V
    7. 6.7  LSF0101 AC Performance (Translating Down) Switching Characteristics, VCCB = 2.5 V
    8. 6.8  LSF0101 AC Performance (Translating Up) Switching Characteristics, VCCB = 3.3 V
    9. 6.9  LSF0101 AC Performance (Translating Up) Switching Characteristics, VCCB = 2.5 V
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Auto Bidirectional Voltage Translation
      2. 8.3.2 Output Enable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Up and Down Translation
        1. 8.4.1.1 Up Translation
        2. 8.4.1.2 Down Translation
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Open-Drain Interface (I2C, PMBus, SMBus, and GPIO)
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
          2. 9.2.1.1.2 Bias Circuitry
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Bidirectional Translation
          2. 9.2.1.2.2 Pull-Up Resistor Sizing
          3. 9.2.1.2.3 Single Supply Translation
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Voltage Translation for Vref_B < Vref_A + 0.8 V
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The LSF family of devices supports bidirectional voltage translation without the need for DIR pin which minimizes system effort (for PMBus, I2C, SMBus, and so forth). The LSF family of devices supports up to 100-MHz up translation and greater than 100-MHz down translation at ≤ 30 pF capacitive load and up to 40-MHz up or down translation at 50 pF capacitive load which allows the LSF family to support more consumer or telecom interfaces (MDIO or SDIO).

LSF family supports 5-V tolerance on I/O port which makes it compatible with TTL levels in industrial and telecom applications. The LSF family is able to set up different voltage translation levels which makes it very flexible.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
LSF0101 DRY (SON, 6) 1.45 mm × 1 mm
DTQ (X2SON, 6) 1 mm × 0.8 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-20230530-SS0I-Q6Z8-X3RQ-1L7FTQ4JGM9Z-low.svg Functional Block Diagram