SDLS973 june   2023 LSF0101

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  LSF0101 AC Performance (Translating Down) Switching Characteristics , VCCB = 3.3 V
    7. 6.7  LSF0101 AC Performance (Translating Down) Switching Characteristics, VCCB = 2.5 V
    8. 6.8  LSF0101 AC Performance (Translating Up) Switching Characteristics, VCCB = 3.3 V
    9. 6.9  LSF0101 AC Performance (Translating Up) Switching Characteristics, VCCB = 2.5 V
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Auto Bidirectional Voltage Translation
      2. 8.3.2 Output Enable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Up and Down Translation
        1. 8.4.1.1 Up Translation
        2. 8.4.1.2 Down Translation
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Open-Drain Interface (I2C, PMBus, SMBus, and GPIO)
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
          2. 9.2.1.1.2 Bias Circuitry
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Bidirectional Translation
          2. 9.2.1.2.2 Pull-Up Resistor Sizing
          3. 9.2.1.2.3 Single Supply Translation
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Voltage Translation for Vref_B < Vref_A + 0.8 V
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LSF0101 UNIT
DTQ (X2SON) DRY (SON)
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 294.4 407.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 188.9 285.2 °C/W
RθJB Junction-to-board thermal resistance 216.8 271.6 °C/W
ψJT Junction-to-top characterization parameter 26.5 113.5 °C/W
ψJB Junction-to-board characterization parameter 216.0 271.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.