SDLS969B may   2018  – may 2023 LSF0102-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics (Translating Down): VCCB = 3.3 V
    7. 6.7  Switching Characteristics (Translating Down): VCCB = 2.5 V
    8. 6.8  Switching Characteristics Translating Up): VCCB = 3.3 V
    9. 6.9  Switching Characteristics (Translating Up): VCCB = 2.5 V
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Auto Bidirectional Voltage Translation
      2. 8.3.2 Output Enable
      3. 8.3.3 Device Functional Modes
        1. 8.3.3.1 Up and Down Translation
          1. 8.3.3.1.1 Up Translation
          2. 8.3.3.1.2 Down Translation
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Bidirectional Translation
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
          2. 9.2.1.1.2 Bias Circuitry
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Bidirectional Translation
          2. 9.2.1.2.2 Pull-Up Resistor Sizing
          3. 9.2.1.2.3 Application Curve
          4. 9.2.1.2.4 Mixed-Mode Voltage Translation
          5. 9.2.1.2.5 Single Supply Translation
          6. 9.2.1.2.6 Voltage Translation for Vref_B < Vref_A + 0.8 V
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.