SDLS969B may   2018  – may 2023 LSF0102-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics (Translating Down): VCCB = 3.3 V
    7. 6.7  Switching Characteristics (Translating Down): VCCB = 2.5 V
    8. 6.8  Switching Characteristics Translating Up): VCCB = 3.3 V
    9. 6.9  Switching Characteristics (Translating Up): VCCB = 2.5 V
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Auto Bidirectional Voltage Translation
      2. 8.3.2 Output Enable
      3. 8.3.3 Device Functional Modes
        1. 8.3.3.1 Up and Down Translation
          1. 8.3.3.1.1 Up Translation
          2. 8.3.3.1.2 Down Translation
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Bidirectional Translation
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
          2. 9.2.1.1.2 Bias Circuitry
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Bidirectional Translation
          2. 9.2.1.2.2 Pull-Up Resistor Sizing
          3. 9.2.1.2.3 Application Curve
          4. 9.2.1.2.4 Mixed-Mode Voltage Translation
          5. 9.2.1.2.5 Single Supply Translation
          6. 9.2.1.2.6 Voltage Translation for Vref_B < Vref_A + 0.8 V
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYP(1)MAXUNIT
VIKInput clamp voltageII = –18 mA, VEN = 0–1.2V
IIHI/O input high leakageVI = 5 V, VEN = 05.0µA
ICCBAVref_B to Vref_A leakageVref_B = VEN = 5.5 V, Vref_A = 4.5 V, IO = 0, VI = VCC or GND1µA
CI(ref_A/B/EN)Input capacitanceVI = 3 V or 011pF
Cio(off)I/O pin off-state capacitanceVO = 3 V or 0, VEN = 04.06.0pF
Cio(on)I/O Pin on-state capacitanceVO = 3 V or 0, VEN = 3 V10.512.5pF
ron(2)On-state resistanceVI = 0, IO = 64 mAVref_A = 3.3 V; Vref_B = VEN = 5 V8.0Ω
Vref_A = 1.8 V; Vref_B = VEN = 5 V9.0
Vref_A = 1.0 V; Vref_B = VEN = 5 V10
VI = 0, IO = 32 mAVref_A = 1.8 V; Vref_B = VEN = 5 V10Ω
Vref_A = 2.5 V; Vref_B = VEN = 5 V15
VI = 1.8 V, IO = 15 mAVref_A = 3.3 V; Vref_B = VEN = 5 V9.0Ω
VI = 1.0 V, IO = 10 mAVref_A = 1.8 V; Vref_B = VEN = 3.3 V18Ω
VI = 0 V, IO = 10 mAVref_A = 1.0 V; Vref_B = VEN = 3.3 V20Ω
VI = 0 V, IO = 10 mAVref_A = 1.0 V; Vref_B = VEN = 1.8 V30Ω
(1) All typical values are at TA = 25°C.
(2) Measured by the voltage drop between the A and B pins at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) pins.