SNVSA23B July   2014  – September 2023 LV284

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed Frequency PWM Control
      2. 7.3.2 Bootstrap Voltage (CB)
      3. 7.3.3 Setting the Ouput Voltage
      4. 7.3.4 Enable (SHDN) and VIN Undervoltage Lockout
      5. 7.3.5 Current Limit
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conduction Mode
      2. 7.4.2 Eco-mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 5 V Output Application
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Design Guide – Step By Step Design Procedure
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Inductor Selection
          2. 8.2.1.2.2 Output Capacitor Selection
          3. 8.2.1.2.3 Schottky Diode Selection
          4. 8.2.1.2.4 Input Capacitor Selection
          5. 8.2.1.2.5 Bootstrap Capacitor Selection
        3. 8.2.1.3 Application Performance Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 ESD Ratings

MIN MAX UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 1000 V
Charged device model (CDM), per JEDEC specification JESD22- C101, all pins(2) 500
(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process, CB PIN passes 500-V test.
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.