SNVSA23B July   2014  – September 2023 LV284

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed Frequency PWM Control
      2. 7.3.2 Bootstrap Voltage (CB)
      3. 7.3.3 Setting the Ouput Voltage
      4. 7.3.4 Enable (SHDN) and VIN Undervoltage Lockout
      5. 7.3.5 Current Limit
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conduction Mode
      2. 7.4.2 Eco-mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 5 V Output Application
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Design Guide – Step By Step Design Procedure
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Inductor Selection
          2. 8.2.1.2.2 Output Capacitor Selection
          3. 8.2.1.2.3 Schottky Diode Selection
          4. 8.2.1.2.4 Input Capacitor Selection
          5. 8.2.1.2.5 Bootstrap Capacitor Selection
        3. 8.2.1.3 Application Performance Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SOT (DDC) UNIT
6 PINS
RθJA Junction-to-ambient thermal resistance 102 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36.9
ψJB Junction-to-board characterization parameter 28.4
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.