SNVSCJ1
August 2023
LV5144
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Revision History
5
Description (continued)
6
Pin Configuration and Functions
6.1
Wettable Flanks
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Input Range (VIN)
8.3.2
Output Voltage Setpoint and Accuracy (FB)
8.3.3
High-Voltage Bias Supply Regulator (VCC)
8.3.4
Precision Enable (EN/UVLO)
8.3.5
Power Good Monitor (PGOOD)
8.3.6
Switching Frequency (RT, SYNCIN)
8.3.6.1
Frequency Adjust
8.3.6.2
Clock Synchronization
8.3.7
Configurable Soft Start (SS/TRK)
8.3.7.1
Tracking
8.3.8
Voltage-Mode Control (COMP)
8.3.9
Gate Drivers (LO, HO)
8.3.10
Current Sensing and Overcurrent Protection (ILIM)
8.3.11
OCP Duty Cycle Limiter
8.4
Device Functional Modes
8.4.1
Shutdown Mode
8.4.2
Standby Mode
8.4.3
Active Mode
8.4.4
Diode Emulation Mode
8.4.5
Thermal Shutdown
9
Application and Implementation
9.1
Application Information
9.1.1
Design and Implementation
9.1.2
Power Train Components
9.1.2.1
Inductor
9.1.2.2
Output Capacitors
9.1.2.3
Input Capacitors
9.1.2.4
Power MOSFETs
9.1.3
Control Loop Compensation
9.1.4
EMI Filter Design
9.2
Typical Applications
9.2.1
Design 1 – 12-A High-Efficiency Synchronous Buck DC/DC Regulator
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curves
9.2.2
Design 2 – High Density, 12-V, 8-A Rail From 48-V Telecom Power
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.1.1
Power Stage Layout
9.4.1.2
Gate Drive Layout
9.4.1.3
PWM Controller Layout
9.4.1.4
Thermal Design and Layout
9.4.1.5
Ground Plane Design
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Device Support
10.1.1
Third-Party Products Disclaimer
10.1.2
Development Support
10.2
Documentation Support
10.2.1
Related Documentation
10.2.1.1
PCB Layout Resources
10.2.1.2
Thermal Design Resources
10.3
Receiving Notification of Documentation Updates
10.4
Support Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGY|20
MPQF116H
Thermal pad, mechanical data (Package|Pins)
RGY|20
QFND755
Orderable Information
snvscj1_oa
snvscj1_pm
1
Features
Device temperature grade 1: –40°C to +125°C ambient temperature range
Versatile synchronous buck DC/DC controller
6-V to 95-V wide input voltage range
125°C maximum junction temperature
0.8-V reference with ±1% feedback accuracy
0.8-V to 60-V adjustable output voltage
45-ns t
ON(min)
for high V
IN
/ V
OUT
ratio
145-ns t
OFF(min)
for low dropout
Lossless R
DS(on)
or shunt current sensing
Optimized for
CISPR 11
and
CISPR 32
Class B
EMI requirements
100-kHz to 1-MHz switching frequency
SYNC in and SYNC out capability
Selectable diode emulation or FPWM
7.5-V gate drivers for standard V
TH
MOSFETs
14-ns adaptive dead-time control
2.3-A source and 3.5-A sink capability
Inherent protection features for robust design
Adjustable output voltage soft start
Hiccup-mode overcurrent protection
Input UVLO with hysteresis
VCC and gate-drive UVLO protection
Precision enable input and open-drain PGOOD indicator for sequencing and control
Thermal shutdown protection with hysteresis
20-pin VQFN package with wettable flanks