SLLS576G July   2003  – February 2024 MAX202

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power
      2. 6.3.2 RS-232 Driver
      3. 6.3.3 RS-232 Receiver
    4. 6.4 Device Functional Modes
      1. 6.4.1 VCC Powered by 5V
      2. 6.4.2 VCC Unpowered
      3. 6.4.3 Truth Tables
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Capacitor Selection
        2. 7.2.2.2 ESD Protection
        3. 7.2.2.3 ESD Test Conditions
        4. 7.2.2.4 Human-Body Model (HBM)
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Switching Characteristics

over recommended ranges of suply voltage and operating free-air temperature (unless otherwise noted; see Figure 7-1)(1)
PARAMETERTEST CONDITIONSMINTYP(2)MAXUNIT
DRIVER SECTION
Maximum data rateCL = 50pF to 1000pF, RL = 3kΩ to 7kΩ
one DOUT switching, see Figure 6-1		120kbit/s
tPLH(D)Propagation delay time,
low- to high-level output		CL = 2500pF, RL = 3kΩ, all drivers loaded,
see Figure 6-1		2µs
tPHL(D)Propagation delay time,
high- to low-level output		CL = 2500pF, RL = 3kΩ, all drivers loaded,
see Figure 6-1		2µs
tsk(p)Pulse skew(3)CL = 150 to 2500pF, RL = 3kΩ to 7 kΩ,
see Figure 6-2		300ns
SR(tr)Slew rate, transition regionCL = 50 to 1000pF, RL = 3kΩ to 7 kΩ,
VCC = 5V, see Figure 6-1		3630V/µs
RECEIVER SECTION (SEE Figure 6-3)
tPLH(R)Propagation delay time,
low- to high-level output		CL = 150pF0.510µs
tPHL(R)Propagation delay time,
high- to low-level output		CL = 150pF0.510µs
tsk(p)Pulse skew(3)CL = 150pF300ns
(1) Test conditions are C1–C4 = 0.1µF at VCC = 5V ± 0.5V.
(2) All typical values are at VCC = 5V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.