SLLS576G July   2003  – February 2024 MAX202

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power
      2. 6.3.2 RS-232 Driver
      3. 6.3.3 RS-232 Receiver
    4. 6.4 Device Functional Modes
      1. 6.4.1 VCC Powered by 5V
      2. 6.4.2 VCC Unpowered
      3. 6.4.3 Truth Tables
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Capacitor Selection
        2. 7.2.2.2 ESD Protection
        3. 7.2.2.3 ESD Test Conditions
        4. 7.2.2.4 Human-Body Model (HBM)
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision F (September 2016) to Revision G (February 2024)

  • Changed the Package Information tableGo
  • Changed values in the Thermal Information tableGo

Changes from Revision E (April 2007) to Revision F (September 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Removed the Ordering Information table; see POA at the end of the data sheetGo
  • Changed values in the Thermal Information table to align with JEDEC standardsGo