SLLS567F May   2003  – July 2024 MAX211

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Protection
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Electrical Characteristics, Driver
    7. 5.7 Switching Characteristics, Driver
    8. 5.8 Electrical Characteristics, Receiver
    9. 5.9 Switching Characteristics, Receiver
  7. 6 Parameter Measurement Information
  8. 7 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitor Selection
      2. 8.1.2 Electrostatic Discharge (ESD) Protection
      3. 8.1.3 ESD Test Conditions
      4. 8.1.4 Human-Body Model
      5. 8.1.5 Machine Model
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|28
  • DW|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)DBDWUNIT
28-PINS
R θJAJunction-to-ambient thermal resistance 66.146°C/W
RθJC(top)Junction-to-case (top) thermal resistance33.233.5°C/W
R θJBJunction-to-board thermal resistance 37.037.1°C/W
ψ JTJunction-to-top characterization parameter 4.67.5°C/W
ψ JBJunction-to-board characterization parameter 36.537.1°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance n/an/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.