Refer to the PDF data sheet for device specific package drawings
The MAX232 device is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/EIA-232-F voltage levels from a single 5V supply. Each receiver converts TIA/EIA-232-F inputs to 5V TTL/CMOS levels. These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5V, and can accept ±30V inputs. Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels.
PART NUMBER | PACKAGE(1) | PACKAGE SIZE(2) |
---|---|---|
MAX232 | SOIC (16) | 9.9mm × 6mm |
SOIC (16) | 10.4mm × 10.3mm | |
PDIP (16) | 19.3mm × 9mm | |
SOP (16) | 10.2mm × 7.8 mm |
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
C1+ | 1 | — | Positive lead of C1 capacitor |
VS+ | 2 | O | Positive charge pump output for storage capacitor only |
C1- | 3 | — | Negative lead of C1 capacitor |
C2+ | 4 | — | Positive lead of C2 capacitor |
C2- | 5 | — | Negative lead of C2 capacitor |
VS- | 6 | O | Negative charge pump output for storage capacitor only |
T2OUT | 7 | O | RS232 line data output (to remote RS232 system) |
R2IN | 8 | I | RS232 line data input (from remote RS232 system) |
R2OUT | 9 | O | Logic data output (to UART) |
T2IN | 10 | I | Logic data input (from UART) |
T1IN | 11 | I | Logic data input (from UART) |
R1IN | 13 | I | RS232 line data input (from remote RS232 system) |
T1OUT | 14 | O | RS232 line data output (to remote RS232 system) |
GND | 15 | — | Ground |
VCC | 16 | — | Supply Voltage, Connect to external 5V power supply |
MIN | MAX | UNIT | |||||
---|---|---|---|---|---|---|---|
VCC | Input Supply voltage range(2) | –0.3 | 6 | V | |||
VS+ | Positive output supply voltage range | VCC – 0.3 | 15 | V | |||
VS– | Negative output supply voltage range | –0.3 | –15 | V | |||
VI | Input voltage range | T1IN, T2IN | –0.3 | VCC + 0.3 | V | ||
R1IN, R2IN | ±30 | ||||||
VO | Output voltage range | T1OUT, T2OUT | VS– – 0.3 | VS+ + 0.3 | V | ||
R1OUT, R2OUT | –0.3 | VCC + 0.3 | |||||
Short-circuit duration | T1OUT, T2OUT | Unlimited | |||||
TJ | Operating virtual junction temperature | 150 | °C |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
Tstg | Storage temperature range | -65 | 150 | °C | |
V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) | 0 | 2000 | V |
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) | 0 | 1000 |
MIN | NOM | MAX | UNIT | ||||
---|---|---|---|---|---|---|---|
VCC | Supply voltage | 4.5 | 5 | 5.5 | V | ||
VIH | High-level input voltage (T1IN,T2IN) | 2 | V | ||||
VIL | Low-level input voltage (T1IN, T2IN) | 0.8 | V | ||||
R1IN, R2IN | Receiver input voltage | ±30 | V | ||||
TA | Operating free-air temperature | MAX232 | 0 | 70 | °C | ||
MAX232I | –40 | 85 |
THERMAL METRIC(1) | SOIC (D) | SOIC wide (DW) | PDIP (N) | SOP (NS) | UNIT | |
---|---|---|---|---|---|---|
16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 84.6 | 71.7 | 60.6 | 88.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 43.5 | 37.6 | 48.1 | 46.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 43.2 | 36.8 | 40.6 | 50.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 10.4 | 13.3 | 27.5 | 13.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 42.8 | 36.4 | 40.3 | 50.3 | °C/W |
PARAMETER | TEST CONDITIONS(2) | MIN | TYP(1) | MAX | UNIT | |||
---|---|---|---|---|---|---|---|---|
ICC | Supply current | VCC = 5.5V, all outputs open, TA = 25°C | 8 | 10 | mA |