SLLS723D April   2006  – February 2024 MAX232E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Electrical Characteristics: Driver
    7. 5.7  Electrical Characteristics: Receiver
    8. 5.8  Switching Characteristics: Driver
    9. 5.9  Switching Characteristics: Receiver
    10. 5.10 Typical Characteristics
  7.   17
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power
      2. 6.3.2 RS-232 Driver
      3. 6.3.3 RS-232 Receiver
    4. 6.4 Device Functional Modes
      1. 6.4.1 VCC Powered by 5V
      2. 6.4.2 VCC Unpowered
      3. 6.4.3 Truth Tables
  9. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)(2)(3) D
(SOIC)		 DW
(SOIC)		 N
(PDIP)		 PW
(TSSOP)		 UNIT
16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 84.6 73.4 60.6 107.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.5 35.1 48.1 38.4 °C/W
RθJB Junction-to-board thermal resistance 43.2 38.3 40.6 53.7 °C/W
ψJT Junction-to-top characterization parameter 10.4 9.4 27.5 3.2 °C/W
ψJB Junction-to-board characterization parameter 42.8 37.7 40.3 53.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.