SLLS348P June   1999  – July 2021 MAX3221

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics – Power
    6. 6.6  Electrical Characteristics – Driver
    7. 6.7  Electrical Characteristics – Receiver
    8. 6.8  Electrical Characteristics – Status
    9. 6.9  Switching Characteristics – Driver
    10. 6.10 Switching Characteristics – Receiver
    11. 6.11 Switching Characteristics – Status
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1.     20
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
      4. 8.3.4 RS232 Status
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Support Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics – Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3)
PARAMETERTEST CONDITIONSMINTYP(1)MAXUNIT
VOHHigh-level output voltageDOUT at RL = 3 kΩ to GND,DIN = GND55.4V
VOLLow-level output voltageDOUT at RL = 3 kΩ to GND,DIN = VCC–5–5.4V
IIHHigh-level input currentVI = VCC±0.01±1μA
IILLow-level input currentVI at GND±0.01±1μA
IOSShort-circuit output current(2)VCC = 3.6 VVO = 0 V±35±60mA
VCC = 5.5 VVO = 0 V±35±60
rOOutput resistanceVCC, V+, and V– = 0 VVO = ±2 V30010MΩ
IoffOutput leakage currentFORCEOFF = GNDVO = ±12 V,
VCC = 3 V to 3.6 V		±25µA
VO = ±12 V,
VCC = 4.5 V to 5.5 V		±25
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(2) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time.
(3) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5