SLLS686E October   2005  – December 2024 MAX3221E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings - IEC Specifications
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Electrical Characteristics: Driver
    8. 5.8  Electrical Characteristics: Receiver
    9. 5.9  Electrical Characteristics: Auto-Power Down
    10. 5.10 Switching Characteristics: Driver
    11. 5.11 Switching Characteristics: Receiver
    12. 5.12 Switching Characteristics: Auto-Power Down
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power
      2. 7.3.2 RS-232 Driver
      3. 7.3.3 RS-232 Receiver
      4. 7.3.4 RS-232 Status
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision D (July 2024) to Revision E (December 2024)

  • Added the SOT-23-THN (DYY) package to the data sheetGo
  • Added Note 2 to the ESD ratings - IEC Specifications Go

Changes from Revision C (July 2021) to Revision D (July 2024)

  • Changed the Device Information table to the Package Information tableGo
  • Changed Pins 8 and 11 to Pins 8 and 13 in the ESD Ratings Go
  • Changed Pins 8 and 11 to Pins 8 and 13 in the ESD ratings - IEC Specifications Go

Changes from Revision B (March 2016) to Revision C (July 2021)

  • Changed the Applications listGo
  • Added ESD ratings IEC Specifications table and added a table note for the minimum requirement to meet the IEC ESD level.Go
  • Changed values in the Thermal Information table for DB and PW packagesGo

Changes from Revision A (May 2006) to Revision B (March 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted Ordering Information table; see the POA at the end of the data sheet Go
  • Changed RθJA thermal values: 82 to 92 for DB package and 108 to 100.3 for PW PackageGo