SLLS686D October   2005  – July 2024 MAX3221E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings - IEC Specifications
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Electrical Characteristics: Driver
    8. 5.8  Electrical Characteristics: Receiver
    9. 5.9  Electrical Characteristics: Auto-Power Down
    10. 5.10 Switching Characteristics: Driver
    11. 5.11 Switching Characteristics: Receiver
    12. 5.12 Switching Characteristics: Auto-Power Down
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power
      2. 7.3.2 RS-232 Driver
      3. 7.3.3 RS-232 Receiver
      4. 7.3.4 RS-232 Status
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.10 Switching Characteristics: Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Maximum data rate CL = 1000pF, RL = 3kΩ, 150 250 kbit/s
tsk(p) Pulse skew(2) CL = 150pF to 2500pF, RL = 3kΩ to 7kΩ, See Figure 6-2 100 ns
SR(tr) Slew rate,
transition region
(see Figure 6-1)		 VCC = 3.3V,
RL = 3kΩ to 7kΩ		 CL = 150pF to 1000pF 6 30 V/µs
CL = 150pF to 2500pF 4 30
(1) All typical values are at VCC = 3.3V or VCC = 5V, and TA = 25°C.
(2) Pulse skew is defined as |tPLH  – tPHL| of each channel of the same device.
(3) Test conditions are C1–C4 = 0.1µF at VCC = 3.3V ± 0.3V; C1 = 0.047µF, C2–C4 = 0.33µF at VCC = 5V ± 0.5V.