SLLS707B January   2006  – December 2023 MAX3223E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 ESD Ratings
    4. 4.4 ESD Ratings - IEC Specifications
    5. 4.5 Thermal Information
    6. 4.6 Electrical Characteristics
    7. 4.7 Driver Section
      1. 4.7.1 Electrical Characteristics
      2. 4.7.2 Switching Characteristics
      3. 4.7.3 ESD Protection
    8. 4.8 Receiver Section
      1. 4.8.1 Electrical Characteristics
      2. 4.8.2 Switching Characteristics
      3. 4.8.3 ESD Protection
    9. 4.9 Auto-Powerdown Section
      1. 4.9.1 Electrical Characteristics
      2. 4.9.2 Switching Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Detailed Design Procedure
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.