SLLS707B January   2006  – December 2023 MAX3223E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 ESD Ratings
    4. 4.4 ESD Ratings - IEC Specifications
    5. 4.5 Thermal Information
    6. 4.6 Electrical Characteristics
    7. 4.7 Driver Section
      1. 4.7.1 Electrical Characteristics
      2. 4.7.2 Switching Characteristics
      3. 4.7.3 ESD Protection
    8. 4.8 Receiver Section
      1. 4.8.1 Electrical Characteristics
      2. 4.8.2 Switching Characteristics
      3. 4.8.3 ESD Protection
    9. 4.9 Auto-Powerdown Section
      1. 4.9.1 Electrical Characteristics
      2. 4.9.2 Switching Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Detailed Design Procedure
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.5 Thermal Information

THERMAL METRIC(1)DB (SOIC)DW (SOIC)PW (TSSOP)UNIT
20 PINS20 PINS20 PINS
RθJAJunction-to-ambient thermal resistance87.276.889.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance41.139.629.0°C/W
RθJBJunction-to-board thermal resistance43.341.541.9°C/W
ψJTJunction-to-top characterization parameter9.212.61.9°C/W
ψJBJunction-to-board characterization parameter42.740.941.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.