SLLS410O January   2000  – June 2021 MAX3232

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics — Device
    6. 6.6 Electrical Characteristics — Driver
    7. 6.7 Electrical Characteristics — Receiver
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC powered by 3 V to 5.5 V
      2. 8.4.2 VCC unpowered, VCC = 0 V
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Standard Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
  • DW|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision N (June 2017) to Revision O (June 2021)

  • Added Applications: Industrial PCs, Wired networking, and Data center and enterprise computingGo
  • Changed the thermal parameter values for D, DB and PW packages in the Thermal Information tableGo

Changes from Revision M (April 2017) to Revision N (June 2017)

  • Changed the Thermal Information table Go

Changes from Revision L (March 2017) to Revision M (April 2017)

  • Changed From: "±" To: "to" in the VCC column of Table 9-1 Go

Changes from Revision K (January 2015) to Revision L (March 2017)

Changes from Revision J (January 2014) to Revision K (January 2015)

  • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from Revision I (January 2004) to Revision J (January 2014)

  • Updated document to new TI data sheet format - no specification changes.Go
  • Deleted Ordering Information table.Go