SLLS676B December   2005  – December 2024 MAX3232E-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Driver Section, Electrical Characteristics
    6. 5.6 Driver Section, Switching Characteristics
    7. 5.7 Receiver Section, Electrical Characteristics
    8. 5.8 Receiver Section, Switching Characteristics
  7.   Parameter Measurement Information
  8. 6Application and Implementation
    1.     Typical Application
  9. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1)TSSOP (PW)UNIT
16-Pins
R θJAJunction-to-ambient thermal resistance 108°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.