SLLS676B December   2005  – December 2024 MAX3232E-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Driver Section, Electrical Characteristics
    6. 5.6 Driver Section, Switching Characteristics
    7. 5.7 Receiver Section, Electrical Characteristics
    8. 5.8 Receiver Section, Switching Characteristics
  7.   Parameter Measurement Information
  8. 6Application and Implementation
    1.     Typical Application
  9. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Driver Section, Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6-1)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
Maximum data rate CL = 1000pF, One DOUT switching,
RL = 3kΩ, See Figure 6-1		 150 250 kbit/s
tsk(p) Pulse skew(3) CL = 150pF to 2500pF, RL = 3kΩ to 7kΩ,
See Figure 6-2		 300 ns
SR(tr) Slew rate, transition region
(see Figure 6-1)		 RL = 3kΩ to 7kΩ,
VCC = 3.3V		 CL = 150pF to 1000pF 6 30 v/μs
CL = 150pF to 2500pF 4 30
(1) Test conditions are C1–C4 = 0.1μF at VCC = 3.3V ± 0.3V; C1 = 0.047μF, C2–C4 = 0.33μF at VCC = 5V ± 0.5V.
(2) All typical values are at VCC = 3.3V or VCC = 5V and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.