SLLS664E August   2005  – June 2021 MAX3232E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions (1)
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics — Device (1)
    7. 6.7  Electrical Characteristics — Driver (1)
    8. 6.8  Electrical Characteristics — Receiver (1)
    9. 6.9  Switching Characteristics (1)
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC Powered by 3 V to 5.5 V
      2. 8.4.2 VCC Unpowered, VCC = 0 V
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC(1) MAX3232E UNIT
PW (TSSOP) D (SOIC) DW (SOIC) DB (SSOP)
16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 108.2 85.9 72.3 103.1 °C/W
RθJCtop Junction-to-case (top) thermal resistance

39.0

43.1

 33.5 49.2 °C/W
RθJB Junction-to-board thermal resistance 54.4 44.5 37.1 54.8 °C/W
ψJT Junction-to-top characterization parameter

3.3

 10.1 7.5 12 °C/W
ψJB Junction-to-board characterization parameter 53.8 44.1 37.1 54.1 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.